*-character searching method of wafer fragment edge

Abstract

The invention provides a *-character searching method of a wafer fragment edge, which is used for searching a cracked edge of a wafer. The wafer is provided with a plurality of vertically-crossed first laser cutting lines and second laser cutting lines; and the first laser cutting lines and the second laser cutting lines are used for separating a plurality of crystal grains on the wafer. The *-character searching method comprises the following steps A-F of: step A, selecting a searching direction; step B, selecting one of the plurality of the crystal grains; step C, capturing a single crystal grain image; step D, judging whether the image of the crystal grain is an integral crystal grain or not; step E, if the image of the crystal grain is the integral crystal grain, moving along the searching direction and repeating the step C; and step F, if the image of the crystal grain is not the integral crystal grain, finishing and marking the position. According to the invention, the integral crystal grain at the outermost edge of the wafer can be accurately marked and times of moving along the searching direction can be automatically calculated, so that cutting times needing to be cut can be known by a user in advance and the cracking work is convenient to carry out.

Description

technical field [0001] The invention relates to a processing method for cutting wafers, in particular to a method for searching the edges of wafer fragments. Background technique [0002] see figure 1 and figure 2 As shown, the wafer splitter is used to split the wafer 1 into individual grains for subsequent packaging operations. Before the wafer 1 is split, the horizontal and vertical Laser cutting line 2, the laser cutting line 2 on the wafer 1 is not broken, and it is connected to about two-thirds of its thickness, and then the wafer 1 is attached with a blue chip 3 (or white film), and then the 1 is covered with a protective film (not shown) for protection, and then sent to a wafer splitter through a fixing fixture 4 for splitting operation. [0003] The wafer splitter includes a worktable 5, a rivet 6, two splitting tables 7 and an image capture system 8. The workbench 5 clamps the fixture 4 and can move and rotate in the plane direction , the splitting knife 6 and...

AI Technical Summary

Problems solved by technology

This method requires expensive panoramic image capture components, and the image data to be processed is huge, so it is difficult to quickly determine the location of the rupture edge 10, and after the rupture edge 10 is determined, before the splitting operation, the user must It is necessary to convert the required number of splitting knives by yourself, which is time-consuming and prone to errors, resulting in too many or insufficient splitting knives, causing unnecessary wear of the splitting knives, or treating good ones as damage and resulting in excellent workmanship low rate

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