Radiator for light-emitting diode (LED) lamp

A technology of LED lamps and radiators, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc. The effect of increasing fluidity and turbulence, increasing heat transfer area, and improving heat transfer coefficient

A technology of LED lamps and radiators, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc. The effect of increasing fluidity and turbulence, increasing heat transfer area, and improving heat transfer coefficient

CN102721024AActive Publication Date: 2012-10-10SOUTH CHINA UNIV OF TECH

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  • Radiator for light-emitting diode (LED) lamp
  • Radiator for light-emitting diode (LED) lamp

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Embodiment Construction

[0022] In order to better understand the present invention, the present invention will be further described below in conjunction with the accompanying drawings. It should be noted that the scope of protection of the present invention is not limited to the scope described in the embodiments.

[0023] The left-right direction of the drawings in the present invention is horizontal, and the front-back direction is vertical.

[0024] Such as figure 1 , 2 Shown, a kind of LED lamp radiator, it comprises heat dissipation substrate 1, small fin 2, large fin 3, dustproof cover 4, air flow channel 5 and window hole 6; Heat dissipation substrate 1 is square, thickness is 3 -5mm, the thickness can be changed; the large fins 3 are distributed longitudinally on the heat dissipation substrate 1 at intervals, preferably at a distance of 8-12mm, and the interval between every two large fins 3 forms an air flow channel 5; the dust cover 4 is provided Above the large fins 3, there is a distanc...

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Abstract

The invention discloses a radiator for a light-emitting diode (LED) lamp. The radiator comprises a heat dissipation base plate, small fins, large fins, a dustproof cover, air flow channels and window holes, wherein the large fins are longitudinally distributed on the heat dissipation base plate at intervals; the space between every two large fins is provided with an air flow channel; the dustproof cover is arranged above the large fins and is 5 to 10mm away from the tops of the large fins; a plurality of small fins and window holes are formed in each large fin at intervals; acute angles or right angles are formed between the small fins and the large fins in the vertical direction; distances among each row of small fins and distances among each row of window holes are 2 to 10mm from top to bottom; and the dustproof cover is connected with the heat dissipation base plate. By the radiator, the heat dissipation area is increased, the fluidity of air around the radiator in the longitudinal and horizontal directions is enhanced, and a heat exchange coefficient between a heat dissipation surface and the air is improved; and the radiator integrates a heat dissipation function, a dustproof function and a waterproof function and meets the requirement of secondary packaging of high-power LED lamps.

Description

technical field [0001] The invention relates to heat dissipation of high-power electronic products, in particular to a heat sink for LED lamps, which is especially suitable for heat dissipation of high-power LED lighting lamps. Background technique [0002] LED lights have the advantages of high luminous efficiency, environmental protection, long life, strong directionality, and good color rendering. They are widely used in display, decoration, road and some special lighting fields. However, the photoelectric conversion efficiency of LEDs only reaches 10-25%. About 75-90% of the energy conversion heat, if the heat is not removed in time, it will cause the performance of the light source to decline and affect the life of the LED. [0003] In the existing technology, designers usually increase the heat dissipation area to remove the heat and control the temperature of the lamp bead, but they do not consider the air flow of the heat dissipation structure; in addition, increasin...

Claims

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Application Information

Patent Timeline
10 Oct 2012
Publication
CN102721024A
IPC
F21V29/00; F21Y101/02; F21V29/77; F21V29/83; F21Y115/10
Inventors
李静; 姚泽民