Circuit board laminating machine
A circuit board and laminator technology, applied in lamination, lamination devices, layered products, etc., can solve the problem that the production efficiency cannot meet the requirements of circuit board manufacturing, the degree of automation of material preparation and feeding devices is not high, and the control is unreliable, etc. problems, to achieve the effect of saving working time, saving space, and reliable control
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2012-10-17
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of circuit board manufacturing equipment, in particular to a circuit board laminating machine. Background technique
[0002] Printed circuit board, also known as printed circuit board, printed circuit board, referred to as circuit board, English referred to as PCB (printed circuit board), circuit board is generally composed of copper foil, resin, inner layer and other components, it needs to be heated, Manufactured by pressurization and other processes. At present, the circuit board has become an indispensable main component for most electronic products to achieve circuit interconnection. With the rapid increase in circuit signal transmission speed and the wide application of high-frequency circuits, higher requirements are placed on circuit boards.
[0003] Among them, the circuit board laminating machine, also known as the circuit board pressing machine, is one of the main production equipment of the cir...
Examples
Embodiment Construction
[0033] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0034] See Figure 1 to Figure 12 , a circuit board laminating machine, which includes a control system, a laminating device 1, a lifting device 3, a conveying device 4 with a double-layer conveying structure, and a cantilever type feeding and unloading device 5, and the board inlet of the laminating device 1 The material bracket 2 is slidingly connected, the lifting device 3, the conveying device 4 and the laminating device 1 are arranged in sequence, the cantilever feeding and unloading device 5 is fixedly installed on the top of the laminating device 1, and the control system is connected with the cantilever feeding and unloading device respectively. Material device 5 and laminating device 1 are controlled and connected.
[0035] Wherein, the lifting device 3 is used for lifting and lowering the prepared circuit board. like figure 2 and image 3...