Bearing platform, error compensation measuring device and error compensation method

Abstract

The invention relates to an object holding platform, an error compensated measurement apparatus and an error compensated measurement apparatus, the error compensated measurement apparatus comprises the object holding platform, a laser, a first multi-axle laser interferometer, a second multi-axle laser interferometer, a first single-axle differential laser interferometer, a second single-axle differential laser interferometer and an optical lens group; the first multi-axle laser interferometer is positioned at one side of the apparatus closing to a second reflecting surface, the second multi-axle laser interferometer is positioned at one side of the apparatus closing to a first reflecting surface, the first single-axle differential laser interferometer is positioned at one side of the apparatus closing to a third reflecting surface, the second single-axle differential laser interferometer is positioned at one side of the apparatus closing to a fourth reflecting surface; the optical lens group divides light beam emitted by the laser into a plurality of beams, and the light beam is respectively injected into the first multi-axle laser interferometer, the second multi-axle laser interferometer, the first single-axle differential laser interferometer and the second single-axle differential laser interferometer.

Description

technical field [0001] The invention relates to microelectronic equipment, in particular to an object bearing platform, an error compensation measuring device and an error compensation method. Background technique [0002] With the improvement of the integration of semiconductor integrated circuits, the feature size of integrated circuits is getting smaller and smaller, and the feature size of integrated circuits will ultimately be determined by optical projection devices. The photolithography process has a very important influence. One of the key technologies to achieve high-precision lithography process is exposure. Its precision directly affects the overlay accuracy and yield of the lithography machine. To achieve high-precision exposure, the position of the object table must be precisely controlled. [0003] Usually, the lithography machine uses a plane mirror interferometer to measure the position of the object table in the horizontal plane. The plane mirror interferom...

AI Technical Summary

Problems solved by technology

[0006] 1. Due to the limitation of the internal space of the lithography machine, the temperature sensor only measures the temperature change at a certain point, not the temperature change of the entire area of ​​the stage. There are errors in the measurement results of this point-to-surface measurement;

[0007] 2. The empirical formula is used to calculate the thermal deformation of the platform, and the expansion coefficient is an ideal value, not the real value of the expansion coefficient of the material, thus introducing calculation errors;

[0008] 3. The material with ultra-low expansion coefficient is very expensive and the manufacturing cost is high

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