Packaging method for light source used in LED fluorescent lamp and light source

A technology of LED fluorescent lamp and packaging method, which is applied in the direction of light source, electric light source, point light source, etc., can solve the problems of heat dissipation and defects, and achieve the effect of improving heat dissipation efficiency and reducing thermal resistance interface

Inactive Publication Date: 2012-10-17
XIZHUO ELECTRONICS TECH SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regardless of one or two, the packaged LEDs are installed on the circuit board, and there are multiple layers of thermal resistance interfaces for heat conduction and heat dissipation, resulting in poor heat dissipation
At present, the design scheme of us

Method used

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  • Packaging method for light source used in LED fluorescent lamp and light source
  • Packaging method for light source used in LED fluorescent lamp and light source

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Experimental program
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Effect test

Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] figure 1 The structure of the light source for the high-power LED fluorescent lamp of the embodiment is shown. In order to more clearly show the assembly relationship between the LED chip and the circuit substrate, the figure 1 Part A is zoomed in, such as figure 2 As shown, the part inside the hemispherical fluorescent silica gel is indicated by a dotted line.

[0019] refer to figure 1 and figure 2 , the light source 1 for the high-power LED fluorescent lamp is made by directly bonding a plurality of LED chips 12 on the circuit substrate 11 . The circuit substrate 11 adopts a double-sided copper-clad laminate, and the copper foil on the back of the substrate 11 is a whole piece of copper foil covering the entire back. The current passages on both sides of the crystal area are provided with gold wire welding areas 114, and the gold wire ...

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Abstract

The invention provides a packaging method for a light source used in an LED fluorescent lamp. The light source uses a two-sided copper-clad plate as a substrate, and copper foil on a front side of the substrate is divided into a plurality of solid crystal areas and current channels. Gold wire welding zones are disposed closed to the solid crystal areas on the current channels. The solid crystal areas are provided with thermal vias throughout the substrate to conduct heat of the solid crystal areas to the copper foil on a back side of the substrate. The packaging method comprises: first, coating solid crystal glue on the solid crystal areas, placing LED chips on the solid crystal glue of the solid crystal areas and pressing the LED chips; then, welding gold wires; and at last, packaging hemispheric fluorescent sillca gel on the LED chips and the gold wires. The invention also discloses a light source used in a high power LED fluorescent lamp manufactured by the above packaging method. The light source manufactured by the above packaging method is characterized by little thermal resistance interface, high heat dissipation efficiency, etc.

Description

technical field [0001] The invention relates to an LED fluorescent lamp for illumination, in particular to a packaging method of a light source for the LED fluorescent lamp and a light source manufactured by the packaging method. Background technique [0002] Traditional fluorescent lamps commonly used in indoor lighting have the disadvantages of short life, high energy consumption, mercury pollution, and flickering. Therefore, people have developed LED fluorescent lamps for solid-state lighting. The existing high-power LED fluorescent lamps have serious heat dissipation problems. , light field, and light attenuation have not been truly resolved. Especially high-power LED fluorescent lamps that use urea board or fiberboard as the circuit board are more serious. High-power LED fluorescent lamps on the market use the following two light sources: 1. The LED plug-in of single-particle bead-shaped packaging is inserted into the urea board or fiberboard. The circuit board is used...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/64H01L33/60H01L25/075F21S2/00F21Y101/02
Inventor 杨然森
Owner XIZHUO ELECTRONICS TECH SHANGHAI
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