Linear motor

Abstract

The invention provides a linear motor, comprising a motor stator and a motor rotor plate. The motor rotor plate is provided with an air inlet channel. Air outlet holes communicated with the air inlet channel are respectively disposed on a first plate surface and a second plate surface of the motor rotor plate. A ventilation channel is disposed between the motor stator and the motor rotor plate, and the air outlet holes are communicated with the ventilation channel. The motor rotor plate can generate a large amount of heat when the motor rotor plate is in a state of high speed and high frequency movement in an operation process, and the motor rotor plate is a most important heat generation source. Since the air inlet channel is disposed on the motor rotor plate, and at least a first air outlet hole is disposed on the air inlet channel, when cooled air is blown into the air inlet channel, the cooled air enters and cools down different positions of the linear motor through the first air outlet hole. Therefore, a reasonable cooling system can guarantee the linear motor stably working under a condition of high speed and high frequency movement, and improve work quality and life of the motor.

Description

technical field [0001] The invention relates to motor technology, in particular to a linear motor. Background technique [0002] As the core equipment for realizing wire bonding, wire bonding machine is a kind of equipment integrating precision machinery, optics, computer and automatic control and many other technologies. The bonding process is to first transfer the IC installed on the substrate to the bonding machine, the chip is recognized by the image recognition system, the position of each bonding point is calculated and corrected, and then the chip and the substrate are bonded with gold wires according to the bonding diagram. The pads on the chip are used to realize the interconnection between the chip and the substrate. Any factor that causes the bonding process to be interrupted or failed will affect the quality of the bond, thereby affecting production efficiency. [0003] The fully automatic wire bonding machine is a key equipment for semiconductor production tha...

AI Technical Summary

Problems solved by technology

[0004] Linear motors are widely used on the workbench of wire bonding machines instead of rotary motors due to their excellent performance. To meet the high acceleration and high positioning accuracy of the workbench, high-speed and high-frequency motion of linear motors is required, which often leads to linear motors. The temperature of the moving sub-board is high, which makes the linear motor unable to work stably and efficiently, or even burns out

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