Double copper-coated surface base material structure for LED flexible strip and manufacturing method thereof
A technology of LED flexible light bar and double-sided copper cladding, which is applied in the direction of chemical instruments and methods, epoxy resin glue, adhesive types, etc., can solve problems such as high cost, low yield rate, and complicated production process, and achieve cost Low cost, high yield rate, and simple production process
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Embodiment 1
[0022] Embodiment one, such as figure 1 As shown, the double-sided copper-clad substrate structure for the LED flexible light bar of the present invention is a three-layer layered structure, which is a copper foil layer 1, a thermosetting adhesive layer 2, and a copper foil layer 1 from top to bottom; The copper foil layer 1, the thermosetting adhesive layer 2 and the copper foil layer 1 are pasted together from top to bottom. Further, the copper foil layer 1 is one or both of electrolytic copper foil or rolled copper foil, for example, both copper foil layers 1 are electrolytic copper foil or rolled copper foil, or one of the copper foil layers 1 is electrolytic copper foil, and another layer of copper foil layer 1 is rolled copper foil. Further, the thickness specification of the copper foil layer 1 is 1 / 3oz~2oz. Further, the thermosetting adhesive layer 2 is one of epoxy modified adhesive layer, acrylic adhesive layer and silicone modified adhesive layer, which has the ad...
Embodiment 2
[0024] Embodiment 2, the manufacturing method of the double-sided copper-clad substrate for LED flexible light strips is: firstly coat a layer of epoxy-modified adhesive, acrylic adhesive or silicone-modified adhesive on the surface of copper foil, and then form a semi- After curing the adhesive film, press it with another copper foil, and finally form a double-sided copper clad LED flexible light bar with a three-layer structure of copper foil layer 1, thermosetting adhesive layer 2 and copper foil layer 1 from top to bottom. Substrate. Further, the copper foil layer 1 is one or both of electrolytic copper foil and rolled copper foil, and the thickness specification of the copper foil layer 1 is 1 / 3oz~2oz. Further, the thickness of the copper foil layer 1 is 12um~70um. Further, the thickness of the thermosetting adhesive layer 2 is 10um~100um.
[0025] In Example 2, the epoxy-modified adhesive is prepared from the following mass ratios of raw materials: epoxy resin (20%-40%...
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Abstract
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