Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit structure and manufacturing method thereof

A technology of circuit structure and production method, which is applied in the direction of circuit, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problem of difficult control of etching rate, accelerated circuit layer etching or dissolution rate, and the thickness of circuit layer copper or copper alloy cannot meet the demand And other problems, to achieve the effect of good electrical quality

Inactive Publication Date: 2015-06-24
SUBTRON TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it will not only accelerate the etching or dissolution rate of the patterned circuit layer made of copper or copper alloy, which makes it difficult to control the etching rate and obtain a good etching result, but also may be due to the accelerated dissolution of copper or copper alloy. The thickness of copper or copper alloy in the circuit layer cannot meet the demand, which affects the electrical quality of the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit structure and manufacturing method thereof
  • Circuit structure and manufacturing method thereof
  • Circuit structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] Figure 1A to Figure 1C A cross-sectional view illustrating a manufacturing method of a circuit structure according to an embodiment of the present invention. Please refer to Figure 1A According to the manufacturing method of the circuit structure of this embodiment, firstly, an insulating layer 110 and a metal layer 120 are provided, wherein the metal layer 120 has an upper surface 122 and a lower surface 124 opposite to the upper surface 122, and the insulating layer 110 It is disposed on the lower surface 124 of the metal layer 120 for supporting the metal layer 120 . In this embodiment, the material of the metal layer 120 is, for example, copper or copper alloy.

[0049] Next, please refer to Figure 1B, forming a surface protection layer 130a on the metal layer 120, wherein the surface protection layer 130a exposes part of the upper surface 122 of the metal layer 120, and the material of the metal layer 120 is different from that of the surface protection layer ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a circuit structure and a manufacturing method thereof. A metal layer having an upper surface is provided. A surface protection layer is formed on the metal layer. The surface protection layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface protection layer. A covering layer is formed on the surface protection layer, and the covering layer covers the surface protection layer.

Description

technical field [0001] The present invention relates to a circuit structure and its manufacturing method, and in particular to a circuit structure and its manufacturing method which can avoid Galvanic effect in etching or other manufacturing processes that can cause electrochemical reactions. Background technique [0002] In the current semiconductor packaging manufacturing process, the circuit board has become one of the frequently used structural components due to the advantages of fine wiring, compact assembly and good performance. The circuit board can be assembled with a plurality of electronic components, such as chips and passive components. Through the circuit board, these electronic components are electrically connected to each other, and signals can be transmitted between these electronic components. [0003] Generally speaking, a circuit board is mainly composed of multiple layers of patterned circuit layers (patterned circuit layer) and multiple layers of dielec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L23/28H01L23/495
Inventor 陈庆盛
Owner SUBTRON TECH