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Laser processing device

A technology of laser processing and laser beams, applied in metal processing, laser welding equipment, metal processing equipment, etc., can solve problems such as difficult to reliably determine the spectrum

Active Publication Date: 2016-09-28
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, since the bonding pad made of metal is located at the bottom of the fine hole formed by irradiation of laser light, there is a problem that even if plasma is generated by irradiation of laser light, it is difficult to reliably determine the inherent nature of the substance emitted by the plasma. spectrum

Method used

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Embodiment Construction

[0066] Hereinafter, preferred embodiments of the laser processing apparatus configured according to the present invention will be described in more detail with reference to the drawings.

[0067] figure 1 A perspective view of a laser processing device constructed according to the present invention is shown. figure 1 The shown laser processing apparatus is provided with: a stationary base 2; On the base 2; the laser beam irradiation unit support mechanism 4, which is configured on the stationary base 2 in a manner capable of moving in the indexing feed direction (Y-axis direction) shown by the arrow Y perpendicular to the X-axis direction; And the laser beam irradiation unit 5 is disposed on the laser beam irradiation unit support mechanism 4 so as to be movable in the focusing point position adjustment direction (Z-axis direction) indicated by arrow Z.

[0068] The above-mentioned chuck table mechanism 3 includes: a pair of guide rails 31, 31 arranged in parallel on the sta...

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Abstract

The present invention provides a laser processing device capable of reliably detecting a metal pad located at the bottom of a pore formed by irradiation of laser light. This laser processing device includes a chuck table that holds a workpiece and a laser beam irradiation unit that irradiates a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes a laser light oscillation unit and a condenser. The optical device condenses the laser light oscillated by the laser light oscillation unit and irradiates it onto the workpiece held on the chuck table. The laser processing device further includes: a reflection unit arranged on the optical axis of the condenser on, the laser light oscillated by the laser light oscillation unit is passed through, and the plasma light emitted by the object is reflected; the wavelength detection unit detects the wavelength of the plasma light reflected by the reflection unit; and the control unit is based on the wavelength from the The detection signal of the detection unit is used to determine the material of the object to be processed, and the laser light irradiation unit is controlled.

Description

technical field [0001] The present invention relates to a laser processing device for forming a laser processing hole in a workpiece such as a semiconductor wafer. Background technique [0002] In the manufacturing process of semiconductor devices, a plurality of regions are divided on the surface of a roughly disc-shaped semiconductor wafer by dividing lines called streets arranged in a grid, and ICs, LSI and other devices. Then, the semiconductor wafer is cut along the lanes, whereby the regions where the devices are formed are divided to manufacture individual semiconductor chips. [0003] In order to achieve miniaturization and high functionality of devices, a module structure in which a plurality of devices are stacked and bonding pads provided on the stacked devices are connected has been put into practical use. The structure of this module structure is to form a through hole (through hole) in the position where the bonding pad is provided on the semiconductor wafer,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/364B23K26/70B23K26/064B23K26/046B23K26/00
CPCB23K26/032B23K26/0643B23K26/0861B23K26/0876B23K26/0622B23K26/382B23K26/40B23K2101/40B23K2103/50
Inventor 能丸圭司森数洋司西野曜子
Owner DISCO CORP
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