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Chamber device and substrate processing equipment

A substrate processing equipment and chamber technology, applied in the field of microelectronics, can solve problems such as complicated electrical wiring, and achieve the effects of large heating area, uniform heating, and easy processing

Active Publication Date: 2014-07-30
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Each group of light bulbs is composed of several light bulbs, and all the light bulbs should be connected in parallel to the power input terminal. The electrical wiring is relatively complicated.

Method used

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  • Chamber device and substrate processing equipment
  • Chamber device and substrate processing equipment
  • Chamber device and substrate processing equipment

Examples

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Embodiment Construction

[0038] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0039] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying Describes, but does not indicate or imply that the device or element referred...

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Abstract

The invention provides a heating device used for substrate processing equipment. The heating device comprises a heating tube which is provided with an anode and a cathode, wherein the heating tube is coiled for multiple circles. According to the heating device used for the substrate processing equipment disclosed by the embodiment of the invention, a big heating area and uniform heating are achieved. The invention also provides a chamber device with the heating device and the substrate processing equipment with the chamber device.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a heating device, a chamber device with the heating device, and a substrate processing device with the chamber device. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition) or sputtering (Sputtering) deposition technology is the most widely used thin film manufacturing technology in the semiconductor industry, generally referring to the thin film preparation process that uses physical methods to prepare thin films; and in the integrated circuit manufacturing industry , Dot refers to the Magnetron Sputtering (Magnetron Sputtering) technology, which is mainly used for the deposition of metal films such as aluminum and copper to form metal contacts and metal interconnections. [0003] Copper interconnection PVD equipment goes through four processes: degassing (Degas), precleaning (Preclean), Ta(N) deposition, Cu deposition. In the degassing ch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/22C23C14/35
Inventor 宗令蓓文莉辉
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD