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Sealing ring structure used for integrated circuit chip

A technology of integrated circuits and sealing rings, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as reliability risks, and achieve the effects of wide popularization and application, convenient processing, and reduced impact

Inactive Publication Date: 2012-12-19
SHANGHAI UNIV OF ENG SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] To suppress noise transmission, some intermittently interrupted seal rings have been used to solve this problem; while they help reduce noise transmission, there is a certain risk to reliability

Method used

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  • Sealing ring structure used for integrated circuit chip
  • Sealing ring structure used for integrated circuit chip
  • Sealing ring structure used for integrated circuit chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown: a seal ring structure for integrated circuit chips provided in this embodiment, is characterized in that: the seal ring 1 has four sides in total, one of the sides 3 is a double-sided structure, and the two sides Two openings 32 are provided on the inner side 31 (the side adjacent to the integrated circuit 2 on the chip).

[0022] The opening 32 can be used to shield the interference of noise; in addition, the use of the outer sealing ring 1 can prevent the chip from being damaged by stress and cracks caused by cutting the chip, and can avoid the infiltration of moisture.

Embodiment 2

[0024] Such as figure 2 As shown, the difference between this embodiment and Embodiment 1 is only that: the segment on the inner side 31 that is disconnected due to the opening is connected to the ground wire pad (not shown in the figure) through the metal wire 4 , that is, make a ground connection (ground connection) to better shield noise currents or signals.

Embodiment 3

[0026] Such as image 3 As shown, the difference between the present embodiment and the first embodiment is only that: both adjacent sides of the sealing ring adopt a double-sided structure, and two openings 32 are provided on the inner side 31 of each double-sided structure.

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Abstract

The invention discloses a sealing ring structure used for an integrated circuit chip. The sealing ring structure is characterized in that at least one side edge of the sealing ring is of a double-side structure, and the inner side of at least one double-side structure is provided with at least one opening. The sealing ring structure provided by the invention can prevent hydrosphere from penetrating, can reduce influence on an integrated circuit from the noises transferred by the sealing ring, can reduce noise coupling, and can prevent an electromagnetic signal from interfering the operation of a sensitive circuit and the like; and the structure is simple, the processing is convenient, and the sealing ring structure has strong practicability and can be widely popularized and applied.

Description

technical field [0001] The invention relates to a sealing ring structure, in particular to a sealing ring structure for an integrated circuit chip. Background technique [0002] Integrated circuits are usually fabricated on silicon wafers or other semiconductor material substrates, then packaged and tested. When packaging, the integrated circuit must first be sawed. The mechanical force of cutting can cause tiny cracks to form on the edges, especially near the corners. The formed cracks may advance toward the central circuit area of ​​the integrated circuit and cause damage to the circuit area therein. In order to protect the circuit area at the center of the integrated circuit, a seal ring is generally arranged on the integrated circuit chip between the circuit area and the dicing line. The sealing ring prevents any cracks (eg, cracks caused by the stress of cutting the integrated circuit) from intruding into the circuit area inside the integrated circuit. In addition, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/552
Inventor 何佳郑祺
Owner SHANGHAI UNIV OF ENG SCI
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