Method for encapsulating vulnerable elements determined in printed board component under effect of dynamic load

Abstract

The invention discloses a method for encapsulating vulnerable elements determined in a printed board component under the effect of dynamic load. The invention aims at providing a method capable of reducing omissions, getting rid of experience dependences effectively, considering the vulnerability of the elements at different positions, sequencing the vulnerability of a plurality of elements and determining the vulnerable elements accurately. The method can be realized by the steps as follows: roughly determining a range of the vulnerable elements in the printed board component by thresholds of feature sizes of the elements, checking the times of each element penetrated by a pitch line of the printed board component in a dominant mode in the determined range, and calculating a vulnerability index P of each element by utilizing the data, wherein the element with the maximum P value is a vibration vulnerable element in the printed board component; then, defining the feature size L of the element as one largest value in three outline dimensions of length, width and height, specifying the threshold of the feature size L as 10mm and taking the L as a foundation for determining the rough range of the vulnerable elements, wherein the L is more than or equal to 10mm; and finally, calculating the P value based on the times of the elements penetrated by the pitch line in the dominant mode.

Description

technical field [0001] The invention relates to a packaging method for determining vulnerable components in a printed board assembly under dynamic load, in particular to a packaging method for vulnerable components in a printed board assembly under vibration load. Background technique [0002] Electronic products have been widely used in aviation, aerospace, navigation, transportation, communication, navigation, industrial electronics, robotics and other aspects of people's lives. These electronic products may be subjected to many different forms of broadband, multi-acceleration level vibration loading. For example, hand-held everyday consumer electronic products such as mobile phones, navigators, and PDAs may slip from the hands of users. When these hand-held devices are dropped or bumped, the printed board assemblies inside them start to vibrate, and since integrated circuit (IC) components are not as "soft" as printed boards, solder joints will eventually fail. Another ...

AI Technical Summary

Problems solved by technology

[0017] In order to overcome the shortcomings of the existing technology that cannot fully consider the factors affecting the vulnerability of components to vibration, provide a method that can reduce omissions, effectively get rid of experience dependence, and can take into account the vulnerability of components in different printed board fixing methods and different positions, and for Sorting the vulnerability of multiple components can more accurately determine vulnerable components, using the combination of characteristic size thresholds and dominant mode nodal lines to determine the packaging method for vulnerable components in printed board assemblies under dynamic loads

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