SOT223 matrix lead frame capable of increasing utilization ratio of materials
A SOT223, lead frame technology, applied in the field of semiconductor packaging and manufacturing, can solve the problems of raw material waste, high production cost, poor shape and size consistency, etc., to improve the yield and quality reliability, high utilization of raw materials, novel and unique structure. Effect
Active Publication Date: 2013-01-30
华天科技(宝鸡)有限公司
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Problems solved by technology
For a long time, packaging manufacturing has been subject to the lead frame model developed in the early 1980s. A lead frame can hold 5 to 20 circuit chips. This frame uses traditional plastic packaging molds, hanging plating line electroplating, and manual rib cutting. This kind of production method not only has low production efficiency, but also has high safety risks when using traditional plastic sealing molds, hanging plating line electroplating, and manual trimming forming molds to configure and process products, and the consistency of product dimensions is poor, the packaging yield is low, and the quality of products depends on more Assigning inspectors to check, resulting in high production costs, low efficiency, and serious waste of raw materials
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[0014] Such as figure 1 , figure 2 As shown, the matrix lead frame of the present invention includes a rectangular frame frame 1 with a length L of 250.000±0.100mm and a width H of 79.500±0.050mm. Sixteen structural units 14 are arranged side by side in the frame frame 1. Each structure Each unit 14 includes two packaging strips arranged side by side, and each packaging strip includes eight packaging units 2 arranged in a row. There are thirty-two packaging strips on the frame frame 1, so that 256 packaging units 2 form 8 rows and 32 columns. matrix arrangement.
[0015] The packaging unit 2 includes a frame unit and a heat sink 5, and the frame unit is provided with a base island 15, such as image 3 and Figure 4 As shown, one end of the base island 15 is connected to the heat sink 5 through the second grid bar 8, and three elliptical locking holes 13 are arranged side by side at the junction of the base island 15 and the heat sink 5, and the long axis direction of the l...
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The invention provides an SOT223 matrix lead frame capable of increasing the utilization ratio of materials. The SOT223 matrix lead frame comprises a lead border, wherein the length of the lead border is 250.000+ / -0.100mm, and the width of the lead border is 79.500+ / -0.050mm. Two hundred and fifty six packaging units are arranged in the border of the frame, and all the packaging units form matrix arrangement with eight rows and thirty two lines. The number of the packaging units of each frame of the lead frame is increased by 2.56 times, the utilization ratio of copper materials is increased by 42.01 percent, the utilization ratio of plastic package materials is increased by 43.86 percent, and namely the output in the same time is increased by 2.56 times. Thus, the total production cost is reduced, namely more products can be produced by the same materials, and the utilization ratio of raw materials is increased.
Description
technical field [0001] The invention belongs to the technical field of semiconductor packaging and manufacturing, and relates to a lead frame, in particular to a matrix lead frame. Background technique [0002] The lead frame used in integrated circuits is a main structural material of integrated circuit packaging. It mainly plays the role of carrying IC chips in the circuit, and at the same time plays the role of connecting the chip and the electrical signal of the external circuit board, as well as the mechanical role of installation and fixing. . For a long time, packaging manufacturing has been subject to the lead frame model developed in the early 1980s. A lead frame can hold 5 to 20 circuit chips. This frame uses traditional plastic packaging molds, hanging plating line electroplating, and manual rib cutting. This kind of production method not only has low production efficiency, but also has high safety risks when using traditional plastic sealing molds, hanging plati...
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IPC IPC(8): H01L23/495
CPCH01L2224/97
Inventor 李六军陈国岚何文海慕蔚
Owner 华天科技(宝鸡)有限公司