LED integrated light source substrate and manufacturing method thereof

Abstract

The invention provides an LED (light-emitting diode) integrated light source substrate. The LED integrated light source substrate comprises a PCB (printed circuit board) line layer, a laminating layer and a base layer, wherein the laminating layer is arranged above the base layer, the PCB line layer is arranged above the laminating layer, a reflection cup body is punched on the base layer, and a cup rim is punched upwards from the back surface of the reflection cup body by using a die. The LED integrated light source substrate provided by the invention has the beneficial effects that the light absorption problem of a laminating layer of the traditional LED integrated light source substrate is solved, the light reflection effect of an LED light source is improved, and the light reflection capacity can be as high as over 98%, thereby improving the brightness of products; the heat dissipation is good, thereby reducing the temperature of products, and improving the reliability of overall products; and the substrate is long in service life and low in cost.

Description

【Technical field】 [0001] The invention relates to a substrate and a manufacturing method thereof, in particular to an LED integrated light source substrate and a manufacturing method thereof. 【Background technique】 [0002] In the prior art, there are the following types of LED integrated light source substrates: [0003] In the traditional PCB circuit board, the circuit is made on the PCB, and then the integrated light source is produced by SMD patch or solid crystal, wire bonding, sealing glue, and packaging process. LEDs also generate heat while emitting light, and the thermal resistance of the PCB circuit board is high. The heat dissipation effect is poor, thereby reducing the reliability and service life of the product. [0004] For traditional aluminum and copper substrates, wires are made on the aluminum-copper substrate, and then SMD patch or crystal bonding, wire bonding, sealing, and packaging processes are used to produce integrated light sources. LEDs also gener...

AI Technical Summary

Problems solved by technology

[0005] The traditional aluminum-copper substrate is drilled, and the die-fixing position is punched with automatic equipment on the traditional aluminum-copper substrate. Blind holes are made, and then the LED chip is fixed in the drilled hole, and the wire is welded and sealed. This method can achieve Thermoelectric separation is extremely effective for heat transfer, but there is an insulating layer on the edge of the hole, and the insulating layer is generally a yellow or milky white non-reflective body, which will absorb part of the light source

There are also processed knife lines at the bottom of the hole, which has poor reflection effect and does not greatly improve the light efficiency of the LED. The light energy that is not reflected will be converted into heat energy in the substrate, increasing the overall temperature of the product, thereby reducing the reliability and use of the product. service life, the use of perforated production will also increase production costs

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