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Light emitting device and method for manufacturing the same

A technology for a light-emitting device and a manufacturing method, which are applied to electrical components, electrical solid-state devices, circuits, etc., can solve problems such as reduction in the amount of light beams, and achieve the effects of improving extraction efficiency, realizing miniaturization, and suppressing deterioration of optical properties.

Inactive Publication Date: 2013-02-06
STANLEY ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the absorption band of the light-emitting element includes the wavelength of reflected light, the ratio of reflection or absorption of lateral propagation light emitted from the side becomes large, and there is a problem that the overall beam quantity decreases

Method used

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  • Light emitting device and method for manufacturing the same
  • Light emitting device and method for manufacturing the same
  • Light emitting device and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0042] figure 1 A cross-sectional view of the light emitting device according to Embodiment 1 is shown. This light emitting device includes a reflective surface (inclined surface) 130 for light extraction at a position close to the side surface of the light emitting element 11 .

[0043] Specifically, a flip-chip light emitting element 11 is mounted on a submount substrate 10 on which wiring is formed on the upper surface by bonding with a plurality of bumps 12 . A resin layer 13 transparent to the light emitted by the light emitting element 11 is mounted on the upper surface of the light emitting element 11 , and a plate-shaped member 14 having a wavelength conversion function is mounted on the resin layer 13 .

[0044] A frame 16 is disposed outside the light emitting element 11 , and the space between the light emitting element 11 and the frame 16 is filled with the reflective material layer 15 . The reflective material layer 15 uses a non-conductive material with high re...

Embodiment approach 2

[0074] Next, as Embodiment 2, a light emitting device in which a plurality of light emitting elements 11 are mounted on one submount substrate 10 will be described. Figure 6 (a), (b), and (c) show cross-sectional views of the light emitting device of Embodiment 2. FIG.

[0075] A plurality of light emitting elements 11 are covered with one plate member 14 . A reflective material layer 15 surrounding a plurality of light emitting elements 11 is arranged. The inclined surface 130 on the side of the resin layer 13 is preferably an inclined surface that linearly connects the bottom surface of the light emitting element 11 and the lower surface of the plate member 14, or is Figure 6 Curved surfaces convex toward the light emitting element 11 side as in (a) to (c). Particularly preferred is a convex curved surface with a curvature of 5 or less.

[0076] Such as Figure 6 As shown in (a) and (b), the surface of the resin layer 13 is a curved surface that is convex toward the pl...

Embodiment approach 3

[0094] Figure 9 (a) shows a cross-sectional view of a light emitting device according to Embodiment 3, Figure 9 (b) and (c) are top views. Such as Figure 9 As shown in (a), a flip-chip type light emitting element 11 is mounted on a submount substrate 10 having wiring formed on the upper surface by bonding with a plurality of bumps 12 . A resin layer 13 having a wavelength conversion function is mounted on the upper surface of the light emitting element 11 , and a transparent plate-shaped member 14 is mounted on the resin layer 13 .

[0095]In the base material of the resin layer 13, phosphor particles 13a are dispersed at a high concentration, and spacers 13b are also dispersed. As the base material, a material transparent to the light emitted by the light emitting element 11 and the fluorescence emitted by the phosphor particles 13 a excited by the light emitted by the light emitting element 11 is used. As for the base material, a transparent resin is used in the same ...

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Abstract

The invention provides a light emitting device and method for manufacturing the same. There is provided a method for producing a light emitting device having a small light emitting area and showing high light extraction efficiency. An uncured resin (13) is dropped on either one or both of a light emitting element (11) and a tabular member (14) in such an amount that the resin is maintained on them by surface tension, the light emitting element (11) and the tabular member (14) are piled up with the uncured resin (13) maintained between them and on a side of the light emitting element by surface tension of the uncured resin (13) to form an uncured resin layer (13) having an inclined side 130, and then the resin layer (13) is cured. The tabular member is constituted with a material having an alkali metal oxide content of 0.2% by weight or lower.

Description

technical field [0001] The present invention relates to a light-emitting device that converts light from a light-emitting element using a wavelength conversion layer and a method for manufacturing the same. Background technique [0002] There is known a light-emitting device that uses a phosphor to convert part of light from a light-emitting element into light of a different wavelength, mixes it with the light from the light-emitting element, and emits the light. As a structure of a light-emitting element using a phosphor-containing layer in this way, as described in Patent Document 1, there is known a structure in which a light-emitting element is arranged in a cup and the cup is filled with a phosphor-containing resin. , and a structure in which only the opening of the cup is covered with a resin layer containing phosphor. In addition, a structure in which the periphery of a light-emitting element is covered with a resin layer containing a phosphor is also disclosed. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60
CPCH01L33/60H01L25/0753H01L33/54H01L33/505H01L33/56H01L2224/16225H01L2224/73253H01L2224/92225H01L2924/0002H01L33/48H01L33/52H01L2924/00
Inventor 伊藤功三郎世古利裕上野一彦铃木直人
Owner STANLEY ELECTRIC CO LTD
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