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Printed circuit board and method of manufacturing the printed circuit board

A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve problems such as short circuit of conductive patterns, deviation of blind hole diameter BD, and flow of conductive paste 143 after thermal curing.

Inactive Publication Date: 2016-11-09
SUMITOMO ELECTRIC IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using a low-viscosity conductive paste 143, the conductive paste 143 will flow when it is thermally cured, so that the diameter BD of the blind hole is prone to deviation.
That is, the diameter BD of the blind hole sometimes extends beyond the land pattern 142, and in this case, the adjacent conductive pattern may be short-circuited.

Method used

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  • Printed circuit board and method of manufacturing the printed circuit board
  • Printed circuit board and method of manufacturing the printed circuit board
  • Printed circuit board and method of manufacturing the printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] · The base material is the conductive substrate 10 on which the insulating layer 20 is laminated.

[0072] ·The conductive substrate 10 is a SUS304 substrate with a thickness of 20 μm.

[0073] · The insulating layer 20 is formed of polyimide resin. The thickness of the insulating layer was set to 10 μm.

[0074] · The insulating layer 20 is irradiated with a YAG laser to form the through hole 41 of the blind hole 40 . The diameter of the through hole 41 was set to 60 μm.

[0075] ・The conductive ink used was an aqueous solution in which copper particles with an average particle diameter of 40 nm were dispersed in water at only 8% by mass.

[0076] · After coating the conductive ink on the substrate, it was heated at 80° C. for about 30 seconds to dry the conductive substrate 10 .

[0077] · After the conductive ink was dried, a 1.0% by mass aqueous solution of ascorbic acid was applied as an oxide remover (reducing agent) on the dried conductive ink. Thereafter, i...

Embodiment 2

[0085] ・The production conditions were the same as in Example 1, except that after the conductive ink was dried, a 1.0% by mass aqueous solution of glutamic acid was applied as an oxide remover (oxide dissolver) to the dry conductive ink. things.

[0086] (result)

[0087] · The resistance value of the blind hole 40 before power-on is 1.2Ω.

[0088] · The resistance value of the blind hole 40 after electrification is 0.09Ω.

Embodiment 3

[0090] ・The production conditions were the same as in Example 1, except that after the conductive ink was dried, a 1.0% by mass aqueous solution of maleic acid was applied as an oxide remover (oxide dissolver) to the dry conductive ink. things.

[0091] (result)

[0092] · The resistance value of the blind hole 40 before power-on is 1.2Ω.

[0093] · The resistance value of the blind hole 40 after electrification is 0.09Ω.

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Abstract

According to this method for producing a printed circuit board, firstly, a through-hole (41) is formed in an insulating layer (20) so as to reach through to an electroconductive substrate (10). Subsequently, a region of the insulating layer (20) including the through-hole (41) is coated with an electroconductive ink including an electroconductive particulate to form an electroconductive particulate layer (31). Thereafter, an electroplating layer (33) is formed by electroplating on the electroconductive particulate layer (31). The electroconductive particulate layer (31) and an electroless plating layer (32) surrounding a blind via (40) are then removed.

Description

technical field [0001] The invention relates to a printed circuit board with blind holes and a method for manufacturing the printed circuit board. Background technique [0002] As a blind hole of a printed circuit board, the technique of patent document 1 is known. Such as Figure 6 As shown, the first conductive pattern 110 and the second conductive pattern 120 are formed on the surface of the insulating layer 130 . In the insulating layer 130 , a blind hole 140 penetrating through the insulating layer 130 is formed. The first conductive pattern 110 and the second conductive pattern 120 are connected to each other by a blind hole 140 . The blind hole 140 is formed by filling the through hole 141 with a conductive paste 143 . [0003] In recent years, the diameter of the blind hole 140 needs to be made smaller in accordance with the high-density wiring of the printed circuit board. Therefore, it is necessary to make the inner diameter of the through hole 141 smaller. In...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40G11B5/60H05K1/05
CPCH05K3/421H05K1/056H05K3/108H05K2203/0709
Inventor 冈良雄上西直太春日隆朴辰珠中间幸喜上原澄人
Owner SUMITOMO ELECTRIC IND LTD
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