Wall board creep age forming method based on finite element mould profile rebound compensation

A technology of creep aging forming and mold surface, which is applied in special data processing applications, instruments, electrical digital data processing, etc. It can solve the problems of unfavorable parts accurate forming, failure to reflect the springback characteristics of parts, and labor and material resources consumption. Achieve the effects of prolonging the service life, reducing the number of process tests and mold repairs, and improving the forming accuracy

Active Publication Date: 2013-02-13
BEIJING AERONAUTICAL MFG TECH RES INST
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  • Description
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Problems solved by technology

This method requires a lot of trial and error and mold repair, which consumes a lot of manpower and material resources
On the other hand, for large and compl

Method used

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  • Wall board creep age forming method based on finite element mould profile rebound compensation
  • Wall board creep age forming method based on finite element mould profile rebound compensation
  • Wall board creep age forming method based on finite element mould profile rebound compensation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0058] Taking the shape of the target part as the initial mold surface for the first time, a finite element analysis model of a typical analog part is established, in which the mold is discretized by the rigid shell element R3D4; the size of the sheet is 751mm×761mm×3mm mm, and the large strain shell element S4R is used for discretization. discrete. The part material is aluminum alloy 7075T651, and the creep strain material model can be selected from the Norton-Baliley creep constitutive equation. The creep tensile test is carried out according to the metal creep tensile and durability test methods, and the least square method is used to fit the test data. Get A and m, n values, the basic parameters of the material are shown in the table below.

[0059]

[0060] Apply the mold surface optimization system, set the mold repair coefficient to c=1, and the maximum allowable gap tolerance to 0.5mm, and carry out the mold surface optimization calculation. After 4 finite element ...

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Abstract

The invention belongs to the technical field of metal plate forming, and relates to a wall board creep age forming method based on finite element mould profile rebound compensation. By the wall board creep age forming method, a finite element method is used for determining a mould profile, technological tests and mould repairing times are largely reduced, appearance control of formed parts can be realized, and forming precision is improved; according to the data through analog computation of forming process and rebound process of a formed piece, the mould profile is compensated, revised and optimized, so that rebound parts are the same as or close to the appearance of an ideal formed piece, and automatic optimization to the mould appearance during a creep age forming process is realized. The forming method can be applicable to various wallboard structures; except for overall wallboard parts, the forming method can be used for welding overall wallboards; welding residual stress can be effectively reduced, stress corrosion resistance capability is enhanced, and service lives of parts are prolonged.

Description

technical field Background technique [0001] Creep aging forming technology is a technology developed for forming parts with complex shapes, especially integral panel parts. It is a forming method that uses the creep characteristics of metals to synchronize forming and aging. Compared with the traditional forming process, this forming method improves the material strength, reduces the residual stress, enhances the stress corrosion resistance, and prolongs the service life of the parts. Integral siding members of complex shapes and structures. This technology is considered to be one of the particularly important metal forming processes for next-generation aircraft. With the increasingly urgent demand for large high-performance aircraft in military and civil aviation, this forming process will play its unique advantages in the manufacture of large and complex integral panels. It has broad application prospects in the development of my country's large aircraft projects. [00...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 曾元松黄遐王明涛
Owner BEIJING AERONAUTICAL MFG TECH RES INST
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