Semiconductor package structure with low inductance
A semiconductor and metal conductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of unable to provide high-speed synchronous switching output noise, not very effective, increasing substrate size, etc. , to achieve a stable common ground reference, increase the available space, and reduce the effect of inductance
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[0029] Therefore, one of the objectives of the present invention is to provide a semiconductor package structure with reduced inductance while still maintaining a small-sized substrate. Several embodiments for realizing the object of the present invention will be described in detail as follows.
[0030] In the embodiments provided by the present invention, the inductance of the ground power supply rail (indicated by VSSQ) is reduced as a reference for description. The method used to reduce the inductance of the ground supply rail VSSQ involves establishing a common ground reference point that eliminates the need for an isolated ground point or multiple ground points. (ground point) needs. Since the ground is always the same, it is practical to use a common ground reference while still allowing for different magnitudes of the supply VCC / VDDQ, that is, when the current demand changes, the Different power balls are used as the power rail VDDQ, while the ground power rail VSSQ i...
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