High-thermal-conductivity and high-heat-dissipation LED lamp and manufacture method thereof

A technology of LED lamps and high heat dissipation, which is applied in the direction of semiconductor devices, lighting and heating equipment, semiconductor devices of light-emitting elements, etc., can solve the problems of high heat generation, low light efficiency, light loss, etc., and achieve improved heat dissipation efficiency and lighting brightness , the effect of improving efficiency

Inactive Publication Date: 2013-02-13
武威荣宝光电新能源发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] (2) In existing LED lamps, each LED chip will reflect and block each other, which will easily cause light loss, resulting in low light efficiency and high heat generation

Method used

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  • High-thermal-conductivity and high-heat-dissipation LED lamp and manufacture method thereof
  • High-thermal-conductivity and high-heat-dissipation LED lamp and manufacture method thereof
  • High-thermal-conductivity and high-heat-dissipation LED lamp and manufacture method thereof

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Experimental program
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Embodiment Construction

[0058] Combine below Figure 2 to Figure 18 , the present invention is further described:

[0059] like figure 2 As shown, a first layer of film 81 corresponding to the fixed position of the LED chip and the fixed position of the chip holder is pasted on the top of the cover plate 10 of the temperature chamber 1 . Next, a layer of high thermal conductivity insulating medium is coated on other areas of the vapor chamber cover plate 10 to form an insulating layer 82 . This insulating layer 82 is used to form a circuit layer.

[0060] like image 3 as shown, then in the figure 2 Paste the second layer of film 83 on the surface again. The reserved position of the circuit is exposed on the second layer of film 83, which is used as a circuit conduction contact during subsequent LED chip packaging.

[0061] Then a layer of copper is sputtered on the surface, and finally the second layer of film 83 and the first layer of film 81 are removed to form the circuit layer 31 . The ...

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Abstract

The invention relates to a high-thermal-conductivity and high-heat-dissipation LED (Light Emitting Diode) lamp and a manufacture method thereof. The LED lamp comprises a constant-temperature plate, wherein a support body inside the constant-temperature plate comprises a plurality of honeycomb unilateral laminar sheets; each honeycomb unilateral laminar sheet comprises a plurality of grooves and a plurality of connection parts; the transition of every two grooves is achieved by the connection part; every two unilateral laminar sheets form a honeycomb hole by the fixed connection of the connection parts or the fixed connection of the bottoms of the grooves; and a plurality of liquid passing holes are formed in each honeycomb unilateral laminar sheet so as to enable one liquid passing hole to be formed between two adjacent honeycomb holes. According to the invention, as the plurality of liquid passing holes are formed in each honeycomb unilateral laminar sheet to enable one liquid passing hole to be formed between the two adjacent honeycomb holes, when the working fluid is injected, uneven liquid, caused by the obstruction of the honeycomb unilateral laminar sheet, in the constant-temperature plate can be omitted, and the injection efficiency is greatly improved at the same time.

Description

technical field [0001] The invention relates to an LED lamp, in particular to an LED lamp with high heat conduction and high heat dissipation and a manufacturing method thereof. Background technique [0002] The popularity of LED lighting applications is a trend, and its technology lies in the system integration of light, mechanics, electricity and heat. The integrated package light source has the advantages of small light-emitting area, easy assembly, and low cost, but its disadvantage is that it requires high heat dissipation. The heat dissipation treatment is related to the luminous efficiency and life of the LED light source chip. The common quality problems of LED lamps are due to the unsatisfactory heat dissipation treatment, which causes serious light decay of the chip and shortens the life of the light source chip. In addition, heat also has a bad effect on the phosphor powder that produces white light, which is also bad for luminous efficiency. [0003] In the ass...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/64H01L33/62F21S2/00F21Y101/02F21K9/20F21Y115/10
Inventor 殷逢宝
Owner 武威荣宝光电新能源发展有限公司
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