Method for producing resin diamond wire

Abstract

The invention discloses a method for producing a resin diamond wire by controlling exposure heights of diamond abrasives through the effect of magnetic force. The method comprises the following steps of (1) mixture preparation: evenly mixing the diamond abrasives in a surface magnetic coating, resin and additives according to a certain process proportion; (2) coating: injecting the prepared mixture into a coating mould, and enabling the mixture to be coated on the surface of a steel wire when the steel wire passes through the coating mould; (3) exposure height adjustment: enabling the steel wire subjected to the coating to enter a uniform magnetic field with adjustable magnetic field intensity, and controlling the ratio of the exposure heights to be 0.4-0.6, wherein a diamond with the surface magnetic coating performs displacement in a resin carcass under the effect of magnetic field force in the magnetic field; and (4) enabling the steel wire subjected to the step (3) to be cured and formed in a curing oven. By means of the method for producing the resin diamond wire, good cutting efficiency and long service life of the diamond wire are ensured to the largest extent.

Description

technical field [0001] The invention relates to a production method of resin diamond wire, in particular to one. The resin diamond wire is used in the squaring of monocrystalline silicon rods or polycrystalline silicon ingots in the solar energy field, the slicing of silicon wafers, the squaring and slicing of sapphire crystal rods in the LED field, and other fields such as magnetic materials. Background technique [0002] Compared with free abrasive diamond wire cutting, the surface damage layer of fixed abrasive diamond wire cutting is shallow, and the sawing surface quality is high. Although electroplated diamond wire has been applied in engineering practice to some extent, the manufacturing cost is relatively high. The cost of resin-bonded saw wire is very low, and the resin-bonded agent has good elasticity, which can effectively reduce the vibration of the cutting system, but its cutting efficiency is not as high as that of electroplated diamond wire saw. The main rea...

AI Technical Summary

Problems solved by technology

Although electroplated diamond wire has been applied in engineering practice, the manufacturing cost is relatively high

The cost of resin-bonded saw wire is very low, and the resin-bonded agent has good elasticity, which can effectively reduce the vibration of the cutting system, but its cutting efficiency is not as high as that of electroplated diamond wire saw.

The main reason is that the diamond edge height of the resin diamond wire is insufficient and cannot be effectively controlled and improved, which directly affects the depth of its cutting into the workpiece, and ultimately leads to relatively insufficient cutting efficiency

Images