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Contact Probes and Probe Units

A probe unit, probe technology, applied in the direction of connection, electrical components, parts of the connection device, etc., can solve the problems of poor conduction and increased inductance, and achieve the effect of reliable conduction

Active Publication Date: 2015-08-12
NHK SPRING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the conventional contact probe disclosed in Patent Document 1, the compression spring is wound at a predetermined pitch (loosely wound), and the inductance increases due to the length of the wire, which may cause conduction with the contact object. bad

Method used

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  • Contact Probes and Probe Units
  • Contact Probes and Probe Units
  • Contact Probes and Probe Units

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0030] figure 1 It is a perspective view showing the structure of the probe unit according to Embodiment 1 of the present invention. figure 1 The probe unit 1 shown is a device used when conducting electrical characteristic inspection of a conductive integrated circuit 100 as an inspection object, and is an electrical connection between the semiconductor integrated circuit 100 and a circuit board 200 that outputs inspection signals to the semiconductor integrated circuit 100 . connected device.

[0031] The probe unit 1 has: contact probes 2 (hereinafter, simply referred to as "probes") with conductivity that are in contact with two different semiconductor integrated circuits 100 and circuit boards 200 as contacted bodies at both ends in the longitudinal direction. 2"); a probe holder 3 for accommodating and holding a plurality of probes 2 according to a prescribed pattern; a position of the semiconductor integrated circuit 100 that is placed around the probe holder 3 and sup...

Embodiment approach 2

[0050] Figure 4 It is a partial sectional view showing the structure of the main part of the probe unit according to Embodiment 2 of the present invention. It should be noted that, in figure 1 The same reference numerals are assigned to the same constituent elements as those of the probe unit 1 described above. Figure 4 The illustrated probe 5 is held by a probe holder 6 and is also formed of a conductive material as in the first embodiment. Probe 5 equipped: in progress figure 1 The first plunger 21 (first contact member) that contacts the connection electrode of the semiconductor integrated circuit 100 during the inspection of the semiconductor integrated circuit 100 shown; the second plunger that contacts the electrode of the circuit board 200 equipped with the inspection circuit. 51 (second contact member); the coil spring 23 provided between the first plunger 21 and the second plunger 51 so as to be able to flexibly connect the two first plunger 21 and the second plu...

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Abstract

Equipped are a conductive first plunger (21) including, on a same axis, a distal end portion (21a) having a tapered distal end shape, a flange portion (21c) extending from a base end side of the distal end portion (21a) and having a diameter larger than a diameter of the distal end portion (21a), a boss portion (21d) having a diameter smaller than a diameter of the flange portion (21c), and a base end portion (21e) having a diameter smaller than a diameter of the boss portion (21d), a conductive second plunger (22) including, on the same axis, a second distal end portion having a tapered distal end shape and a boss portion (22c) having a diameter substantially equal to a diameter of the base end portion (21e), and a coil spring (23) including a coarsely wound portion (23a) formed by winding at a predetermined pitch with an inner diameter equal to or larger than the diameter of the boss portion (21d) and a tightly wound portion (23b) formed by tightly winding with an inner diameter substantially equal to the diameter of the boss portion (22c), so that the first plunger (21) and the second plunger (22) are connected to each other on the same axis.

Description

technical field [0001] The present invention relates to a contact probe and a probe unit used for conducting state inspection or operating characteristic inspection of inspection objects such as semiconductor integrated circuits and liquid crystal panels. Background technique [0002] Conventionally, when performing conduction state inspection or operating characteristic inspection of inspection objects such as semiconductor integrated circuits and liquid crystal panels, in order to realize the electrical connection between the inspection object and the signal processing device that outputs inspection signals, a plurality of contact probes are used. needle probe unit. In the probe unit, it can be applied to the inspection of high integration and miniaturization by narrowing the pitch between contact probes with the progress of high integration and miniaturization of semiconductor integrated circuits and liquid crystal panels in recent years. The subject's technology has als...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/067G01R1/073
CPCG01R1/06722G01R1/067G01R1/07314H01L2924/14H01L2924/00G01R1/073H01L22/00H01L24/72H01R13/2421H05K7/1069
Inventor 风间俊男相马一也松井晓洋
Owner NHK SPRING CO LTD
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