High-temperature hot-melting micro-jet dispensing device with piezoelectric drive diaphragm

Abstract

The invention discloses a high-temperature hot-melting micro-jet dispensing device with a piezoelectric drive diaphragm, belonging to the technical fields of mechanical engineering, microelectronic packaging and microelectronic component production. Piezoelectric ceramic is used as a drive component for pushing the drive diaphragm to deform and extrude a micro-jet material in a nozzle cavity, so that a fluid pressure is sharply changed and the micro-jet material is regularly jetted to form microdroplet adhesives. The piezoelectric ceramic is driven via a computer signal, so that the generation of the microdroplet adhesives can be accurately controlled. The temperature of the micro-jet material is adjusted via a heating device and a temperature control device so that the viscosity of the micro-jet material can be changed. A jet mechanism and a drive mechanism are independently designed and installed on a rack respectively, and heat isolation is performed between the drive mechanism and a heating area, so that the limit of the temperature characteristic of the piezoelectric ceramic on the heating temperature of the device can be reduced, and further the micro-jet material can be heated to a high temperature. The high-temperature hot-melting micro-jet dispensing device disclosed by the invention is high in thrust, small, precise and controllable in the dimensions of the generated microdroplet adhesives, suitable for low-viscosity and high-viscosity micro-jet materials at high temperature, and has great application and development prospects in the fields of microelectronic packaging and micro optical component production.

Description

technical field [0001] The invention relates to a micro-spray and dispensing device, in particular to a piezoelectric-driven membrane type high-temperature hot-melt micro-spray and dispensing device. It belongs to the technical fields of mechanical engineering, microelectronic package and microelectronic component manufacturing. Background technique [0002] The gradual improvement of people's requirements for the precision and miniaturization of electronic products has promoted the continuous development of semiconductor chip manufacturing technology and microelectronic packaging technology. In microelectronic packaging, the production of solder ball arrays and the precise distribution of fluid materials for packaging are the key to ensuring good heat dissipation and vibration resistance of the chip under the premise of pursuing small size and light weight of electronic products. These fluids mainly include surface mount adhesives, solder pastes, fluxes, UV adhesives, silv...

AI Technical Summary

Problems solved by technology

In this device, there is no heat insulation between the piezoelectric ceramic and the working chamber, and the temperature of the working chamber can be directly transmitted to the piezoelectric ceramic. Due to the limitation of the temperature characteristics of the piezoelectric ceramic, this device can only be used for low-viscosity materials at room temperature. droplet jetting

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