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A three-station multi-wire cutting workbench

A multi-wire cutting and workbench technology, applied in work accessories, fine work devices, manufacturing tools, etc., can solve problems such as restricting the production capacity of equipment, and achieve the effects of simple structure, low processing cost, and improved production capacity.

Active Publication Date: 2015-08-05
ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the current single crystal cutting equipment, the limited cutting stations greatly restrict the production capacity of the equipment

Method used

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  • A three-station multi-wire cutting workbench
  • A three-station multi-wire cutting workbench
  • A three-station multi-wire cutting workbench

Examples

Experimental program
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Embodiment Construction

[0024] Such as figure 1 As shown, the present invention provides a three-station multi-wire cutting workbench, including three cutting stations 5, the three cutting stations 5 are respectively fixed with a material plate 2, each of which can be equipped with a diameter It is a 3-inch monocrystalline silicon 7, the workbench 4 is equipped with four nozzles 6, and each of the four nozzles 6 can have a monocrystalline silicon 7 in each pair. The diameter of the monocrystalline silicon 7 and the width of a nozzle 6 are the sum Less than the distance between the center axes of adjacent cutting stations 5, the thickness of the silicon wafer after cutting is 300 microns.

[0025] The three cutting stations 5 are all horizontal strip-shaped internal grooves on the lower surface of the worktable 4, and each includes an upper part and a lower part. The three cutting stations 5 are parallel to each other and have the same height. The minimum width of the part is greater than the maximum wid...

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Abstract

The invention provides a three-position multi-line cutting table which comprises three cutting positions, wherein material plates are fixed in the three cutting positions respectively, three to-be-cut work pieces are arranged on the material plates respectively, the table is provided with four nozzles, one to-be-cut work piece is arranged between two of the four nozzles, and the sum of the diameter of each to-be-cut work piece and the width of each nozzle is less than the distance between the central axes of two adjacent cutting positions. The invention has the benefits that the three-position multi-line cutting table improves the production capacity of a multi-line cutting machine and has the advantages of simple structure, convenience in maintenance, low manufacturing cost and high production efficiency.

Description

Technical field [0001] The invention belongs to the technical field of crystal wire cutting, and particularly relates to a workbench for realizing three-station multi-wire cutting of semiconductor single crystals. Background technique [0002] After decades of rapid development, the cutting of semiconductor single crystals has developed from the initial inner (outer) circular cutting technology to the currently widely used multi-wire cutting technology, which has made great progress in cost reduction and product quality improvement. [0003] Driven by the high-speed rotating main roller, the cutting steel wire carries the mortar sprayed from the nozzle to grind and cut the crystal material. There are two main types of multi-wire cutting machines currently used: single-station cutting machines and double-station cutting machines. Early multi-wire cutting machines generally used single-station cutting, that is, only one single crystal can be processed at a time; later, more advanced...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/00
Inventor 郭红慧范猛张雪囡孙红永蒲福利张磊王帅
Owner ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD