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LED (Light Emitting Diode) integrated light source with tubular structure

A tubular structure and LED packaging technology, applied in the field of LED integrated light source, can solve the problems of large contact thermal resistance between radiator and light source board, complex assembly process, small heat dissipation area, etc., and achieve convenient application, large irradiation range and uniform light emission Effect

Inactive Publication Date: 2013-03-20
DONGGUAN SINOINNOVO SEMICON LIGHTING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese Patent Publication No. CN 101994921A discloses an LED planar light source. A number of LED chips are packaged on a metal substrate. The light-emitting surface is a plane and the light-emitting angle is small, which brings certain limitations to the application of LED optics.
Chinese patent authorization number CN 202501238U discloses a 360° three-dimensional multi-group multi-faceted LED lamp, which fixes multiple LED planar light sources on the base. This module achieves split heat dissipation, but the heat dissipation area is small. The contact thermal resistance between them is large and the assembly process is complicated

Method used

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  • LED (Light Emitting Diode) integrated light source with tubular structure
  • LED (Light Emitting Diode) integrated light source with tubular structure
  • LED (Light Emitting Diode) integrated light source with tubular structure

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Embodiment Construction

[0019] In order to further understand the features, technical means, and achieved specific objectives and functions of the present invention, and to analyze the advantages and spirit of the present invention, the present invention will be further described through the following examples.

[0020] The present invention provides a tubular LED integrated light source, including a tubular packaging bracket 1, which provides a heat sink for the LED to achieve heat dissipation. A plurality of heat dissipation fins 11 protrude from the inner wall of the tubular packaging bracket 1 to increase the heat dissipation area. The LED heat is conducted to the cooling fins 11 and then dissipated. A plurality of ventilation holes are uniformly drilled on the tubular packaging support 1 , and the heat on the tubular packaging support 1 and the cooling fins 11 is rapidly dissipated through air convection. Open a strip-shaped LED packaging cavity 13 around the tubular packaging bracket 1; place t...

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Abstract

The invention discloses an LED (Light Emitting Diode) integrated light source with a tubular structure. The LED integrated light source is provided with a heat radiating structure and is luminous within a range of 360 degrees. According to the invention, the LED integrated light source comprises a tubular packaging bracket, wherein an LED packaging chamber, in which a plurality of strip-shaped recesses are formed, is formed in the outer wall of the tubular packaging bracket; a plurality of chip heat conducting glues are arranged on the bottom surfaces of the recesses of the LED packaging chamber; LED chips are arranged on the chip heat conducting glues; the LED chips are connected with each other through chip interconnecting wires; lead bonding pad plates are arranged at two ends of the LED packaging chamber; the LED chips are connected with the lead bonding pad plates through chip interconnecting wires; a fluorescent powder colloid is arranged in the LED packaging chamber; and a plurality of air convection holes are formed in the tubular packaging bracket. The LED integrated light source with the tubular structure has the advantages of simple structure, uniformity of luminance, large irradiation range and convenient application; and through the adoption of the tubular packaging bracket with heat radiation fins and the air convection holes, the heat generated by the LED chips is effectively radiated.

Description

technical field [0001] The invention relates to an LED integrated light source, in particular to an LED integrated light source with a heat dissipation structure and 360-degree tubular light emission. Background technique [0002] At present, most of the LED integrated packaging technology stays on the planar package. Multiple LED chips are evenly arranged and bonded on the metal or ceramic planar substrate, and then these chips are connected with metal wires. Finally, the phosphor powder is mixed with the potting glue. The LED chip is limited by its own light emitting angle, and the light emitting angle of the packaged integrated light source generally does not exceed 150 degrees. Chinese Patent Publication No. CN 101994921A discloses an LED planar light source. Several LED chips are packaged on a metal substrate. The light-emitting surface is a plane and the light-emitting angle is small, which brings certain limitations to the application of LED optics. [0003] When LE...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21V19/00F21Y101/02F21V29/77F21V29/83F21Y115/10
Inventor 赵利民
Owner DONGGUAN SINOINNOVO SEMICON LIGHTING
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