Unlock instant, AI-driven research and patent intelligence for your innovation.

Thin-film transistor and electronic unit

A thin film transistor and gate electrode technology, applied in the field of electronic equipment, can solve the problems of complex manufacturing process and achieve the effect of performance improvement

Inactive Publication Date: 2013-03-27
SONY CORP
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For other reasons, surface modification of the gate insulating layer complicates the TFT manufacturing process and causes repeatability problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin-film transistor and electronic unit
  • Thin-film transistor and electronic unit
  • Thin-film transistor and electronic unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that description is made in the following order.

[0027] 1. thin film transistor

[0028] 2. Variation

[0029] 3. Application Examples of Thin Film Transistors (Electronic Devices)

[0030] 3-1. LCD Monitor

[0031] 3-2. Organic EL display

[0032] 3-3. e-paper display

[0033] (1. Thin film transistor)

[0034] First, the configuration of a thin film transistor according to an embodiment of the present invention will be described. Figure 1A shows the planar configuration of a thin film transistor, Figure 1B shows the cross-sectional configuration, and Figure 1B The cross-sectional surface shown in is along the Figure 1A The cross-sectional surface of the B-B line shown in . It should be noted that, Figure 1A just shows Figure 1B part of the thin film transistor assembly shown in, Figure 1B according to F...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A thin-film transistor includes: a gate electrode; a semiconductor layer separated from the gate electrode with a separation insulating layer in between; and a source electrode and a drain electrode that are connected with the semiconductor layer and are separated from each other. Between the source electrode and the drain electrode, a thickness of the separation insulating layer at a first region where the gate electrode does not overlap both the source electrode and the drain electrode is smaller than a thickness of the separation insulating layer at a second region where the gate electrode overlaps one or both of the source electrode and the drain electrode.

Description

technical field [0001] The present invention relates to a thin film transistor including a semiconductor layer, and electronic equipment using the thin film transistor. Background technique [0002] In recent years, thin film transistors (TFTs) have been used as switching devices and the like in various electronic devices. As such TFTs, inorganic TFTs in which a semiconductor layer (channel layer) is formed using an inorganic semiconductor material and organic TFTs in which a semiconductor layer (channel layer) is formed using an organic semiconductor material are known. [0003] The TFT includes: a gate electrode; a semiconductor layer separated from the gate electrode by a gate insulating layer therebetween; and a source electrode and a drain electrode connected to the semiconductor layer and separated from each other. [0004] In order to realize a high-performance TFT, it is necessary to secure insulation between a gate electrode and a source electrode and between a gat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/10H01L51/05H10K99/00
CPCH01L51/0516H01L51/052H01L29/4908H01L29/7869H01L29/42368H01L51/00H01L29/41733H10K10/468H10K10/471H01L29/42384H10K99/00
Inventor 平井畅一
Owner SONY CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More