Two-sided scrubbing unit for wafers

Abstract

A two-sided scrubbing unit for wafers is provided with a two-sided scrubbing device located at the tail end of a two-sided scrubbing section conveying mechanism. The two-sided scrubbing device comprises a scrubbing support, two brushes capable spraying liquid from inside, two scrubbing shaft components which synchronously rotate, and a driving component driving the scrubbing shaft components to rotate. The scrubbing shaft components are rotatably borne on the scrubbing support which is mounted on a frame, and the two brushes are sleeved on the corresponding scrubbing shaft components respectively and are located on two sides of a wafer to be detected respectively. The two-sided scrubbing unit further comprises a wafer rotation driving device for driving the wafer located in the two-sided scrubbing device to rotate, an unloading device, and a discharge device for pushing the wafer on the scrubbing section conveying mechanism to a discharge wafer box. The two-sided scrubbing unit for wafers is high in automation, the front and reverse sides of the wafer are scrubbed simultaneously, scrubbing is effectively, removing small particles smaller than 0.3 micrometers in diameter is evidently effective, the problem that other devices fail to clean is solved, the high requirement for cleanness of the surface of the wafer is guaranteed effectively, and the high requirement that number of particles which are 0.3 micrometers in diameter and have surface cleanness of the 2-inch wafer is not more than 30 is met.

Description

technical field [0001] The invention relates to a wafer double-sided scrubbing machine. Background technique [0002] As the main raw material of LEDs, wafers have high requirements for surface cleanliness. If there are too many residual dirt particles, it will seriously affect the pass rate of the next chip production. [0003] Currently, in the wafer manufacturing process, it is well known that unnecessary residues left on the wafer surface during processing must be cleaned. Examples of such fabrication operations include plasma etching and chemical mechanical polishing. If unwanted residues and particles are left on the surface of the wafer during successive manufacturing operations, these residues and particles can cause defects such as scratches on the wafer surface and improper interactions between metallization features. In some cases, such defects can cause devices on the wafer to become non-functional. To avoid the additional cost of discarding wafers with non-fu...

AI Technical Summary

Problems solved by technology

[0004] However, it is known that most of the wafer cleaning equipment after chemical mechanical polishing is a single-sided brush, the cleaning process is complicated, and satisfactory cleaning efficiency cannot be achieved. Residual slurry and a large number of defects can be seen along the edge of the wafer surface. In addition, for the wafer The secondary pollution is also very serious, and the automation rate is not high. Therefore, the industry also needs a wafer double-sided scrubbing machine to solve the above problems

Images