Wafer double-sided scrubbing machine

Abstract

A two-sided scrubbing unit for wafers is provided with a two-sided scrubbing device located at the tail end of a two-sided scrubbing section conveying mechanism. The two-sided scrubbing device comprises a scrubbing support, two brushes capable spraying liquid from inside, two scrubbing shaft components which synchronously rotate, and a driving component driving the scrubbing shaft components to rotate. The scrubbing shaft components are rotatably borne on the scrubbing support which is mounted on a frame, and the two brushes are sleeved on the corresponding scrubbing shaft components respectively and are located on two sides of a wafer to be detected respectively. The two-sided scrubbing unit further comprises a wafer rotation driving device for driving the wafer located in the two-sided scrubbing device to rotate, an unloading device, and a discharge device for pushing the wafer on the scrubbing section conveying mechanism to a discharge wafer box. The two-sided scrubbing unit for wafers is high in automation, the front and reverse sides of the wafer are scrubbed simultaneously, scrubbing is effectively, removing small particles smaller than 0.3 micrometers in diameter is evidently effective, the problem that other devices fail to clean is solved, the high requirement for cleanness of the surface of the wafer is guaranteed effectively, and the high requirement that number of particles which are 0.3 micrometers in diameter and have surface cleanness of the 2-inch wafer is not more than 30 is met.

Description

technical field [0001] The invention relates to a wafer double-sided scrubbing machine. Background technique [0002] Currently, in the wafer manufacturing process, it is well known that unnecessary residues left on the wafer surface by the manufacturing operations that have been performed must be cleaned. Examples of such fabrication operations include plasma etching and chemical mechanical polishing. If unwanted residues and particles are left on the surface of the wafer during successive manufacturing operations, these residues and particles can cause defects such as scratches on the wafer surface and improper interactions between metallization features. In some cases, such defects can cause devices on the wafer to become non-functional. To avoid the additional cost of discarding wafers with non-functioning devices, it is therefore imperative to properly and efficiently clean wafers after manufacturing operations that leave unwanted residues on the wafer surface. A cle...

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Problems solved by technology

[0003]However, the known wafer cleaning equipment after chemical mechanical polishing is mostly a single-sided brush, the cleaning process is complicated, and satisfactory cleaning efficiency cannot be achieved. You can see the remaining slurry and a large number of defects. In addition, the secondary pollution to the wafer is also very serious, and the automation rate is not high. Therefore, the industry also needs a double-sided wafer cleaning machine to solve the above problems

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