Ceramic target material preparation method for CIGS (copper indium gallium selenide) based solar film battery light absorption layer
A technology for solar cells and light absorbing layers, applied in coatings, metal material coating processes, ion implantation plating, etc., can solve the problems of unstable quality and high cost
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Embodiment 1
[0022] 1. The size of the target in this embodiment is □80mm, the inner radius of the fan-shaped ring is 10mm, and the outer radius is 35mm, such as figure 1 and 2 Tc part shown;
[0023] 2. In 2 Se 3 , Ga 2 Se 3 and Cu 2 The angles of the smallest annular sectors of Se are 5°, 20° and 20°, respectively;
[0024] 3. Ga 2 Se 3 、In 2 Se 3 and CuSe ceramic thin plates are processed into annular sectors of the size described in steps 1 and 2 respectively, and the target plane structure is as follows image 3 As shown, 1, 2 and 3 in the figure represent Cu 2 Se, In 2 Se 3 and Ga 2 Se 3 The smallest splicing unit of ;
[0025] 4. Deposit Ni with a thickness of 1 μm on the processed ceramic block by magnetron sputtering to improve the bonding strength between the target and the copper backplane;
[0026] 5. Processed on a 6mm thick copper backplane figure 1 and 2 The annular groove shown is used as the area for target splicing;
[0027] 6. In the market purchase I...
Embodiment 2
[0032] 1. The size of the target in this embodiment is □80mm, the inner radius of the fan-shaped ring is 10mm, and the outer radius is 35mm, such as figure 1 and 2 Tc part shown;
[0033] 2. In 2 Se 3 , Ga 2 Se 3 and Cu 2 The angles of the smallest annular sectors of Se are 7°, 18° and 20°, respectively;
[0034] 3. Ga 2 Se 3 、In 2 Se 3 and CuSe ceramic thin plates are processed into annular sectors of the size described in steps 1 and 2 respectively, and the target plane structure is as follows Figure 4 As shown, 1, 2 and 3 in the figure represent Cu 2 Se, In 2 Se 3 and Ga 2 Se 3 The smallest splicing unit of ;
[0035] 4. Deposit Ni with a thickness of 1 μm on the processed ceramic block by magnetron sputtering to improve the bonding strength between the target and the copper backplane;
[0036] 5. Processed on a 6mm thick copper backplane figure 1 and 2 The annular groove shown is used as the area for target splicing;
[0037] 6. In the market purchase ...
Embodiment 3
[0043]1. The size of the target in this embodiment is □80mm, the inner radius of the fan-shaped ring is 10mm, and the outer radius is 35mm, such as figure 1 and 2 Tc part shown;
[0044] 2. In 2 Se 3 , Ga 2 Se 3 and Cu 2 The angles of the smallest annular sectors of Se are 7°, 16° and 22°, respectively;
[0045] 3. Ga 2 Se 3 、In 2 Se 3 and CuSe ceramic thin plates are processed into annular sectors of the size described in steps 1 and 2 respectively, and the target plane structure is as follows Figure 5 As shown, 1, 2 and 3 in the figure represent Cu 2 Se, In 2 Se 3 and Ga 2 Se 3 The smallest splicing unit of ;
[0046] 4. Deposit Ni with a thickness of 1 μm on the processed ceramic block by magnetron sputtering to improve the bonding strength between the target and the copper backplane;
[0047] 5. Processed on a 6mm thick copper backplane figure 1 and 2 The annular groove shown is used as the area for target splicing;
[0048] 6. In the market purchase I...
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Abstract
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