Bionic surface structure for strengthening evaporation heat exchanging of liquid film

A technology of surface structure and film evaporation, applied in heat transfer modification, heat exchange equipment, lighting and heating equipment, etc. The effect of film thickness, spreading uniformity and reducing heat transfer resistance

Inactive Publication Date: 2013-04-03
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the wall shape or its size parameters are not properly selected, it may cause local temporary or permanent rupture of the liquid film and deteriorate the heat and mass transfer effect.

Method used

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  • Bionic surface structure for strengthening evaporation heat exchanging of liquid film
  • Bionic surface structure for strengthening evaporation heat exchanging of liquid film
  • Bionic surface structure for strengthening evaporation heat exchanging of liquid film

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Experimental program
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Embodiment Construction

[0023] See figure 1 , figure 2 , image 3 with Figure 4 As shown, in this embodiment, three-dimensional bionic zigzag unit bodies 1 are distributed on the surface 2 of the substrate of the heat transfer tube or heat transfer plate. The inclination angle α of the three-dimensional bionic zigzag unit body 1 is 50-70°, and the inclined sawtooth They overlap each other and are closely arranged. The angle β between the sides of the three-dimensional bionic zigzag unit body 1 and the horizontal direction is 70 to 90°; the width W of the three-dimensional bionic zigzag unit body 1 is 0.2 to 1 mm. The thickness T of the zigzag unit body 1 is 0.2 to 1 mm, and the height H of the three-dimensional bionic zigzag unit body 1 is 0.3 to 1.2 mm; the three-dimensional bionic zigzag unit body 1 is in a tilted state, and its tilt direction is in line with the flow direction of the liquid film Consistent.

[0024] The tip of the three-dimensional bionic zigzag unit body 1 has three micro-scale mi...

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Abstract

The invention discloses a bionic surface structure for strengthening evaporation heat exchanging of a liquid film, which is characterized in that three-dimensional bionic zigzag unit bodies are distributed on the surface of a substrate of a heat transferring pipe or a heat transferring plate, and the structural size of each three-dimensional bionic zigzag unit body is nanometer grade or millimeter grade; the three-dimensional bionic zigzag unit bodies are obliquely arranged, the inclined direction of the three-dimensional bionic zigzag unit bodies is consistent with the flowing direction of the liquid film, and the inclined three-dimensional bionic zigzag unit bodies are mutually lapped with one another; a sharp part of each three-dimensional bionic zigzag unit body is provided with three micro-sized micro zigzag structures, and the three micro-sized micro zigzag structures are arranged in a manner that two lower micro zigzag structures are arranged on two ends and one higher micro zigzag structure is arranged in the middle, and the heights of the two lower micro zigzag structures are identical to each other; the three-dimensional bionic zigzag unit bodies are distributed in a rhombic shape or a rectangular shape; the three-dimensional bionic zigzag unit bodies are mutually lapped with one another, so that the liquid film can be uniformly spread, and dry spots or dry points can be prevented from appearing on the surface; and the zigzag structure surface can control the flowing direction of the liquid film, so that the thickness of the liquid film is reduced, the heat transferring resistance can be effectively reduced, and the evaporation heat transferring efficiency of the liquid film is increased.

Description

Technical field [0001] The invention relates to a surface structure, in particular to a bionic surface structure that enhances the evaporation and heat exchange of a liquid film. Background technique [0002] Liquid film evaporation heat transfer is an efficient heat transfer technology developed in recent years. It has unique advantages such as small flow, small temperature difference, high heat and mass transfer coefficient, simple structure and low power consumption. It is used in traditional industrial fields and high-tech In the field, heat transfer enhancement under high heat flux density has received outstanding attention. Studies have shown that the main reasons affecting the heat and mass exchange of liquid film evaporation are the flow pattern and thickness of the liquid film. How to maintain the flow of the liquid film and make it evenly wet the heat transfer surface to prevent heat transfer due to thin liquid rupture When dry spots or areas appear on the surface, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F13/00
Inventor 张成春康芷铭王晶韩志武任露泉
Owner JILIN UNIV
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