Atomic layer deposition equipment with high safety

Abstract

The invention relates to semiconductor process equipment, in particular to atomic layer deposition equipment with high safety. The atomic layer deposition equipment comprises a vacuum component, a heating component, an air passage component, a plasma generating component and a control component, wherein the control component comprises a touch screen, an industrial computer and a data processing module; the touch screen is connected with the industrial computer; the industrial computer is connected with the data processing module; and the data processing module is connected with the vacuum component, the heating component, the air passage component and the plasma generating component respectively. The touch screen, the industrial computer and the data processing module are taken as control devices for replacing a computer, so that the entire equipment is simple and clear in structure and is convenient to assemble, produce and maintain, and damage of sudden accidents to the equipment can be prevented effectively.

Description

technical field [0001] The invention relates to a semiconductor process equipment, in particular to an atomic layer deposition equipment with high safety based on an industrial computer and a touch screen. Background technique [0002] Traditional atomic layer deposition equipment includes vacuum components, heating components, gas path components, plasma generation components and control components. The control components are connected to other components to realize the sending and receiving of data instructions. However, the control components of atomic layer deposition equipment are mostly implemented by computers. The computer needs to directly communicate with each component, provide adapters according to the input and output interfaces of each component, and then complete the interaction of data instructions according to a certain communication protocol, such as figure 1 shown. [0003] However, the control structure of the existing atomic layer deposition equipment ...

AI Technical Summary

Problems solved by technology

[0003] However, the control structure of the existing atomic layer deposition equipment adopts multiple data transmission interfaces and devices, and the computer needs to coordinate and schedule multiple devices. In order to connect these devices, special ports are needed, and the connection ports provided by ordinary computers are often insufficient. Therefore, an external circuit is required for data exchange between the computer and vacuum components, heating components, gas circuit components, and plasma generation components, which leads to a large volume of control devices, which is not conducive to production and packaging

In addition, the staff need to operate the atomic layer deposition equipment through the computer, so the computer cannot be packaged, it must be exposed to the outside of the atomic layer deposition equipment, and it is not easy to fix

During the operation of the atomic layer deposition equipment, due to some improper behavior (such as collision, etc.), the computer may be shut down unexpectedly, which will cause the atomic layer deposition equipment to fail and cause damage to the equipment

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