Semiconductor light-emitting device and manufacturing method of the same

Abstract

According to one embodiment, a light-emitting unit (2) which emits light, a wavelength conversion unit (8) which includes a phosphor and which is provided on a main surface of the light-emitting unit, and a transparent resin (9) which is provided on top of the wavelength conversion unit, are prepared. The transparent resin has a greater modulus of elasticity and / or a higher Shore hardness than the wavelength conversion unit (8).

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from Japanese Patent Application No. 2012-078364 filed on 03 / 29 / 12; the entire contents of which are hereby incorporated by reference. technical field [0003] Embodiments described herein relate to semiconductor light emitting devices and methods of manufacturing the same. Background technique [0004] In one example, a semiconductor light-emitting device has a semiconductor element (hereinafter simply referred to as a light-emitting element), a wavelength conversion unit including a phosphor, a light-emitting element that emits blue light such as a blue LED (light-emitting diode), and, for example, emits light complementary to blue light. Phosphor of yellow light. Use these parts together for white light. Other phosphors emitting light of other wavelengths (ie colors) can also be combined into the wavelength conversion unit in this way to obtain other colors by combi...

AI Technical Summary

Problems solved by technology

However, at this stage, since the surface of the wavelength conversion unit is roughened by etching, air may enter the surface undesirably through gaps in the irregular surface.

When this happens, robotic equipment will not be able to pick and / or reliably deliver semiconductor light emitting devices

Resulting pick failures lead to lower yields

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