Method of simulation design for surface-mounted microwave devices

Abstract

The invention discloses a method of simulation design for surface-mounted microwave devices. The method includes: determining coup0ling degree of coupling lines in a microwave device according to bandwidth of the microwave device, and estimating frequency response of the microwave device within the required bandwidth through a circuit model; after materials are selected, estimating physical properties of the laminated device to determine process parameters and ensure effectiveness of simulation by electromagnetic field finite element method; establishing a two-dimensional model by electromagnetic field finite element algorithm, and precisely extracting the required coupling degree; performing electromagnetic field simulation to a bridge by three-dimensional electromagnetic field analysis; establishing an electric field distribution model of the bridge under the action of microwave power and electric field distribution under the coaction of multiple signals, locating a largest electric field, and analyzing a most possible breakdown position under the action of high power; and establishing a radiating model of the bridge under the action of microwave power. The method enables design to be greatly easier, design labor to be reduced and design cost to be lowered, and assists in improving accuracy and reliability in microwave device design.

Description

technical field [0001] The invention relates to a simulation design method of a surface mounted microwave device. Background technique [0002] With the development of microwave technology, the design of microstrip circuits and systems has gradually become the design and application of transmission lines, monolithic microwave integrated circuits and microwave passive circuits. However, in many current designs, microwave devices cannot be directly mounted on the surface of the printed circuit board. Engineers have to directly design passive circuits on microstrip lines or design circuits into many modules, and then use coaxial connections. , but these methods lead to bulky equipment and complicated debugging tasks, which are not conducive to mass production of products, and cannot take advantage of the advantages of monolithic microwave integrated circuits. [0003] In the design process of microwave devices that can be mounted on the surface of PCB boards, there are many pa...

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Problems solved by technology

However, in many current designs, microwave devices cannot be directly mounted on the surface of the printed circuit board. Engineers have to directly design passive circuits on microstrip lines or design circuits into many modules, and then use coaxial connections. , but these methods lead to bulky equipment and complicated debugging tasks, which are not conducive to mass production of products, and cannot take advantage of the advantages of monolithic microwave integrated circuits

[0003] In the design process of microwave devices that can be moun...

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