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Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

A technology of epoxy resin and composition, applied in the field of epoxy thermosetting composition, can solve the problems of slow progress and consumption of excess epoxy resin

Inactive Publication Date: 2013-04-24
BLUE CUBE IP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, curing of excess epoxy requires high temperatures and proceeds slowly without the benefit of catalysts as they are consumed during low temperature curing

Method used

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  • Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
  • Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof
  • Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

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Experimental program
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Embodiment

[0100] Epoxy networks prepared according to the disclosed embodiments (Samples 1-12) and phenol-only epoxy networks without reaction with any excess epoxy resin (Comparative Samples 1-4) A comparison was made with a sample of epoxy alone (comparative sample 5). In the following, sample preparation is generally described, with details of the individual sample formulations given in Table 1.

[0101] Sample 1-12

[0102] A prescribed amount of diglycidyl ether of bisphenol-A (D.E.R. TM 332 epoxy resin, available from The Dow Chemical Co., Midland, Michigan (The Dow Chemical Co., Midland, Michigan), referred to as "BADGE" in Table 1) and 1,1,1-tris-( 4-Hydroxyphenyl)ethane ("THPE", ex Aldrich), mixed as indicated in Table 1, and heated to 165°C in a 1 liter, 3-necked round bottom flask, resulting in a clear homogeneous liquid. Bisphenol-A ("BA", PARABIS grade, available from The Dow Chemical Company, Midland, MI) was then added to the flask, and the mixture was reheated to 180°...

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Abstract

In one aspect, embodiments disclosed herein relate to a process for curing a thermoset composition, including: reacting a curable composition comprising an epoxy resin, an epoxy-reactive compound, and a catalyst, wherein there is a stoichiometric excess of the epoxy resin; to form an intermediate product having unreacted epoxy groups and secondary hydroxyl groups; and etherifying at least a portion of the unreacted epoxy groups and the secondary hydroxyl groups, catalyzed by the catalyst, to form a thermoset composition.

Description

[0001] This application is the PCT international application date is April 22, 2008, the national application number is 200880015360.1 (the original PCT international application number is PCT / US2008 / 061163), the invention title is "the epoxy thermosetting composition containing excess epoxy resin and A divisional application of the application for its preparation method". technical field [0002] Embodiments disclosed herein relate generally to epoxy thermosetting compositions. More specifically, the presently disclosed embodiments relate to epoxy thermoset compositions having improved toughness and / or higher heat resistance. Background technique [0003] Epoxy resins are among the most widely used engineering resins and are well known for their use in composite materials with high strength fibers. Epoxy resins form a glassy network, exhibit excellent corrosion and solvent resistance, good adhesion, a reasonably high glass transition temperature, and appropriate electrical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/18C08L63/00
CPCC08G59/18C08G59/066C08L63/00
Inventor 莫里斯·乔尔·马克斯考特尼·劳伦斯·施尔曼
Owner BLUE CUBE IP