Aluminum substrate material of copper-aluminum composite plate strip, copper-aluminum composite plate strip and processing method of copper-aluminum composite plate strip
A copper-aluminum composite plate and processing method technology, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of difficult stamping of copper-aluminum composite materials, inconsistent copper and aluminum soft annealing temperatures, etc. Achieve the effect of reducing the cost of raw materials, high production efficiency and significant economic benefits
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Embodiment 1
[0031] The aluminum matrix material of the copper-aluminum composite strip in this embodiment is composed of the following components in weight percentage: Si0.2%, Fe1.0%, Cu0.05%, Mn0.15%, impurity components≤0.03% , the balance being Al.
[0032] The copper-aluminum composite strip of this embodiment is composed of an aluminum base layer and a copper cladding layer, and the thickness of the copper cladding layer accounts for 20% of the thickness of the entire strip; the aluminum base layer is made of an aluminum matrix material, and the aluminum matrix The material is composed of the following components in weight percentage: Si0.2%, Fe1.0%, Cu0.05%, Mn0.15%, impurity components≤0.03%, and the balance is Al; the copper cladding layer The copper cladding material is used, the grade of the copper cladding material is TU2, the state is TM, and it is high-purity, extra-soft copper.
[0033] The processing method of the copper-aluminum composite strip of the present embodiment s...
Embodiment 2
[0040] The aluminum matrix material of the copper-aluminum composite strip in this embodiment is composed of the following components in weight percentage: Si0.5%, Fe0.8%, Cu0.1%, Mn0.1%, impurity components≤0.03% , the balance being Al.
[0041] The copper-aluminum composite strip of this embodiment is composed of an aluminum base layer and a copper cladding layer, and the thickness of the copper cladding layer accounts for 15% of the thickness of the entire strip; the aluminum base layer adopts an aluminum matrix material, and the aluminum matrix The material is composed of the following components in weight percentage: Si0.5%, Fe0.8%, Cu0.1%, Mn0.1%, impurity components≤0.03%, and the balance is Al; the copper cladding layer The copper cladding material is used, the grade of the copper cladding material is TU2, the state is TM, and it is high-purity, extra-soft copper.
[0042] The copper cladding material is high-purity, extra-soft copper strip, the copper strip grade is ...
Embodiment 3
[0050] The aluminum matrix material of the copper-aluminum composite strip in this embodiment is composed of the following components in weight percentage: Si0.3%, Fe0.45%, Cu0.2%, Mn0.15%, impurity components≤0.03% , the balance being Al.
[0051] The copper-aluminum composite strip of this embodiment is composed of an aluminum base layer and a copper cladding layer, and the thickness of the copper cladding layer accounts for 15% of the thickness of the entire strip; the aluminum base layer adopts an aluminum matrix material, and the aluminum matrix The material is composed of the following components in weight percentage: Si0.3%, Fe0.45%, Cu0.2%, Mn0.15%, impurity components≤0.03%, and the balance is Al; the copper cladding layer The copper cladding material is used, the grade of the copper cladding material is TU2, the state is TM, and it is high-purity, extra-soft copper.
[0052] The processing method of the copper-aluminum composite strip of the present embodiment speci...
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