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Aluminum substrate material of copper-aluminum composite plate strip, copper-aluminum composite plate strip and processing method of copper-aluminum composite plate strip

A technology for a copper-aluminum composite plate and a processing method, which is applied in the field of metal plate and strip processing, can solve the problems of difficult stamping of copper-aluminum composite materials, inconsistent soft annealing temperatures of copper and aluminum, etc., so as to reduce raw material costs, high production efficiency, and improve The effect of overall performance

Active Publication Date: 2014-09-24
LUOYANG TONGYI METAL MATERIAL DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a copper-aluminum composite strip material to solve the problem that the annealing temperature of copper and aluminum is inconsistent and the copper-aluminum composite material is difficult to stamp

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The aluminum matrix material of the copper-aluminum composite strip in this embodiment is composed of the following components by weight percentage: Si0.2%, Fe1.0%, Cu0.05%, Mn0.15%, and impurity components ≤0.03% , The balance is Al.

[0032] The copper-aluminum composite plate strip in this embodiment is composed of an aluminum base layer and a copper cladding layer. The thickness of the copper cladding layer accounts for 20% of the thickness of the entire plate and strip; the aluminum base layer adopts an aluminum base material, and the aluminum base layer The material consists of the following components by weight percentage: Si0.2%, Fe1.0%, Cu0.05%, Mn0.15%, impurity components ≤0.03%, the balance is Al; the copper coating The copper cladding material is used, the grade of the copper cladding material is TU2, the state is TM, and it is high-purity, super soft copper.

[0033] The processing method of the copper-aluminum composite strip in this embodiment specifically i...

Embodiment 2

[0040] The aluminum matrix material of the copper-aluminum composite strip in this embodiment is composed of the following components by weight percentage: Si0.5%, Fe0.8%, Cu0.1%, Mn0.1%, impurity components ≤0.03% , The balance is Al.

[0041] The copper-aluminum composite plate strip in this embodiment is composed of an aluminum base layer and a copper cladding layer. The thickness of the copper coating layer accounts for 15% of the thickness of the entire plate and strip; the aluminum base layer uses an aluminum base material, and the aluminum base The material is composed of the following components by weight percentage: Si0.5%, Fe0.8%, Cu0.1%, Mn0.1%, impurity components ≤0.03%, the balance is Al; the copper coating The copper cladding material is used, the grade of the copper cladding material is TU2, the state is TM, and it is high-purity, super soft copper.

[0042] The copper coating material is high-purity, extra-soft copper tape, the copper tape grade is TU2, and the st...

Embodiment 3

[0050] The aluminum matrix material of the copper-aluminum composite strip in this embodiment is composed of the following components by weight percentage: Si0.3%, Fe0.45%, Cu0.2%, Mn0.15%, and impurity components ≤0.03% , The balance is Al.

[0051] The copper-aluminum composite plate strip in this embodiment is composed of an aluminum base layer and a copper cladding layer. The thickness of the copper coating layer accounts for 15% of the thickness of the entire plate and strip; the aluminum base layer uses an aluminum base material, and the aluminum base The material consists of the following components by weight percentage: Si0.3%, Fe0.45%, Cu0.2%, Mn0.15%, impurity components ≤0.03%, the balance is Al; the copper coating The copper cladding material is used, the grade of the copper cladding material is TU2, the state is TM, and it is high-purity, super soft copper.

[0052] The processing method of the copper-aluminum composite strip in this embodiment specifically includes t...

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Abstract

The invention discloses an aluminum substrate material of a copper-aluminum composite plate strip, simultaneously relates to the copper-aluminum composite plate strip and a processing method thereof, and belongs to the technical field of a metal plate strip processing. According to the invention, the copper-aluminum composite plate strip adopts the aluminum substrate material containing Si, Fe, Cu and Mn and a copper clad material; the strength of the aluminum substrate material is increased by adding elements of Si, Fe, Cu and Mn, and the processing property of the aluminum material is changed to be identical to the processability of the copper clad material, so that the problems that the soft annealing temperatures of copper and aluminum are different in the plate strip manufacturing process and composite materials are difficult to be punched are solved; and the composite material can reach deep drawing properties of pure copper and pure aluminum. In a process of processing the plate strip, a billet is prepared through an oxygen-free high-pressure continuous casting, and then the billet is subjected to processes, such as cold rolling, intermediate annealing, finish rolling and finished product annealing, so that the integral property of the plate strip is further improved. The copper-aluminum composite plate strip processed by the method is high in production efficiency, stable in quality, advanced in technology, and remarkable in economic benefit, and saves energy and materials.

Description

Technical field [0001] The invention relates to an aluminum matrix material of a copper-aluminum composite plate and strip, and also to a copper-aluminum composite plate and strip and a processing method thereof, belonging to the technical field of metal plate and strip processing. Background technique [0002] The copper-aluminum composite strip material is a bimetal composite material with aluminum as the matrix and copper as the cladding. Among them, copper and aluminum are important non-ferrous metals, which have been widely used in industrial and civilian fields. Copper has good electrical conductivity, thermal conductivity, corrosion resistance and antibacterial properties, and aluminum has good electrical and thermal conductivity properties. In comparison between the two, copper resources are relatively short, while aluminum resources are relatively abundant. At the same time, the proportion of aluminum is relatively small and the price is low. The copper-aluminum compos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C21/02C22C21/00C22F1/04C22F1/043B32B15/01
Inventor 尚郑平王项巩旭东符利强徐汤红樊延府
Owner LUOYANG TONGYI METAL MATERIAL DEV
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