PCB (printed circuit board) and electronic device

A technology for electronic devices and conductive layers, applied in the field of electronics, can solve problems such as peeling off and easy blistering of solder resist layers, and achieve the effects of preventing blistering, uniform heat dissipation, and reduced thermal expansion and cold shrinkage deformation rate

Inactive Publication Date: 2013-05-01
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a PCB, aiming to solve the problem that the solder resist layer of the existing PCB is easy to bubble and fall off after being fired.

Method used

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  • PCB (printed circuit board) and electronic device
  • PCB (printed circuit board) and electronic device
  • PCB (printed circuit board) and electronic device

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Embodiment Construction

[0010] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0011] In the embodiment of the present invention, the conductive layer is set in a grid shape to reduce the actual heating area of ​​the conductive layer. When the PCB passes through the furnace, the conductive layer actually receives less heat, and the heat is relatively dispersed, so that the heat dissipation is uniform and rapid, and the entire conductive layer heats up. The expansion and contraction deformation rate is greatly reduced, thereby preventing the solder mask layer from bubbling and falling off after the PCB goes through the furnace, and improving the reliability of the PCB and elect...

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Abstract

The invention is suitable for the electronic technology field, which provides a PCB (printed circuit board) and an electronic device. The PCB comprises a base plate, a conducting layer and a solder resist layer, wherein the conducting layer and the solder resist layer are overlaid on the base plate in sequence, and the conducting layer is in a grid shape. According to the invention, the conducting layer is set into the grid shape so as to reduce the practical heating area of the conducting layer. When the PCB passes through a stove, the practical heating of the conducting layer is small, and the heating is dispersed so as to enable the conducting layer to dissipate heat evenly and quickly. The deformation rate of the expansion caused by heat and contraction caused by cold of the whole conducting layer is greatly reduced, so that the phenomenon that the solder resist layer is foamed and fallen after the PCB passes through the stove is avoided, and the reliabilities of the PCB and the electronic device is improved.

Description

technical field [0001] The invention belongs to the field of electronic technology, and in particular relates to a PCB and an electronic device. Background technique [0002] When the PCB (Printed Circuit Board, printed circuit board, referred to as hard board) board with plug-in components passes through the wave soldering furnace, the soldering surface of the PCB board needs to be in contact with the boiling tin pick in the tin furnace to reach the component pins. The purpose of tinning. Due to the high boiling point of the tin pick, during the wave soldering process, when the PCB surface is in contact with the tin pick, the surface of the PCB will be heated sharply. Layers are blistered or peeled off. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide a PCB, aiming to solve the problem that the solder resist layer of the existing PCB is easy to bubble and fall off after being reheated. [0004] The embodiment of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 黄占肯
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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