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Phase change heat pipe for satellite payload and instrument board

A technology of instrument board and phase change, which is applied in the field of heat dissipation device, cooling, and temperature uniformity, can solve the problems of difficult balance of satellite load and instrument board temperature, single heat pipe with large volume and weight, etc., and achieve good isothermal performance, small weight index, The effect of large heat transfer capacity

Inactive Publication Date: 2013-05-01
SHANGHAI SATELLITE ENG INST
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  • Abstract
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  • Application Information

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Problems solved by technology

[0006] In order to solve problems such as the large volume and weight of the single heat pipe in the prior art, it is difficult to balance the temperature of the satellite load and the instrument board, the object of the present invention is to provide a phase change heat pipe for satellite load and instrument board

Method used

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  • Phase change heat pipe for satellite payload and instrument board
  • Phase change heat pipe for satellite payload and instrument board
  • Phase change heat pipe for satellite payload and instrument board

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Embodiment Construction

[0012] Preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0013] figure 1 Be the cross-sectional view of phase change heat pipe for satellite load and instrument panel of the present invention, as figure 1 As shown in the embodiment, the device includes:

[0014] A rectangular metal aluminum profile, the central area of ​​which is a heat pipe hole with an Ω-shaped axial channel core, at least two axial phase change holes are distributed on both sides of the heat pipe hole, and the phase change material is injected into the phase change hole Sealed to form a phase change material chamber.

[0015] As mentioned above, the phase change heat pipe of the present invention is formed by combining the heat pipe and the phase change material. It can not only utilize the good isothermal property of the heat pipe, but also utilize the good constant temperature property of the phase change material at the temperature o...

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Abstract

The invention relates to a cooling, temperature equalization and radiation device, and discloses a phase change heat pipe for a satellite payload and an instrument board. The phase change heat pipe comprises a rectangular metal aluminum profile. A heat pipe hole with an omega-shaped axial groove pipe core is formed in the central area of the rectangular metal aluminum profile. At least two axial phase change holes are distributed in each of the two sides of the heat pipe hole. After a phase change material is injected into the phase change holes, the phase change holes are sealed to form phase change material chambers. According to the phase change heat pipe, the problems of large size, great weight, difficulty in the temperature equalization of the satellite payload and the instrument board, and the like of a single heat pipe are solved, and the beneficial effects of high heat transfer capability, large phase change filling volume, low weight index, high isothermality, convenience for the machining of a heat pipe profile, and the like are achieved.

Description

technical field [0001] The invention relates to cooling, uniform temperature and heat dissipation devices, in particular to heat pipes for satellite loads and instrument boards. Background technique [0002] At present, most of the stand-alone units and payloads on satellites use metal aluminum ammonia heat pipes to balance the temperature. With the development of satellite technology and the continuous expansion of demand, in the future, there will be more and more load stand-alone machines with intermittent switching, high power, and high heat flux, which have the characteristics of complex structure, high measurement accuracy requirements, large heat generation, and high temperature control requirements. , the traditional, single heat pipe has limited ability to equalize the temperature, and can no longer fully adapt to the complex temperature control requirements. [0003] Therefore, the present invention adopts the phase-change heat pipe combined with the phase-change ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F28D15/02
Inventor 陆江峰王智磊刘荣辉
Owner SHANGHAI SATELLITE ENG INST
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