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A semiconductor test method

A test method and semiconductor technology, applied in the direction of single semiconductor device test, semiconductor/solid-state device test/measurement, etc., can solve problems such as poor contact between test modules and needle tips, achieve reduced retest rate, accurate test values, and improve work efficiency Effect

Active Publication Date: 2017-08-15
CSMC TECH FAB2 CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to propose a semiconductor test method, which can solve the problem of poor contact between the test module and the needle tip, make the test value more accurate, and reduce the test abnormality very well

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Embodiment Construction

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0025] The principle of the present invention is that in the step of "needling of the test module", the second needling (Double touch) is performed on the basis of the first needling. Acupuncture pressure is expressed by the depth of the needle point when the disk and the needle point just touch. Needle insertion position and needle pressure remain unchanged. There are many ways to control needle injection. One is to use the probe table itself to control needle injection. During needle injection, the upward moveme...

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Abstract

The invention discloses a method for testing a semiconductor. The method comprises that the test head has probes, and when a semiconductor product needs to be tested, the test contact pad on the product is located under the test head, and the test head is pressed down to make the probe contact Testing the contact pad for testing is characterized in that a second needle piercing is performed on the basis of the first needle piercing so as to increase the longitudinal contact area between the probe and the pad. Through the solution of the present invention, the test problem caused by excessive contact resistance in the electrical parameter test process is solved, the test value is more accurate, the retest rate of the factory machine is reduced, the production capacity of the factory machine is improved, and the Production line efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to a semiconductor testing method using secondary needle sticking. Background technique [0002] During the production or use of semiconductor products, it may be necessary to test the electrical characteristics of the semiconductor products first. The current test method usually adopts the push-down type, that is, the test head has downwardly protruding probes. When it is necessary to test semiconductor products, the test contact pad (PAD) on the product is located under the test head, and the test head is pressed down to make it The probe touches the test contact pad for testing. [0003] Generally, the electrical parameter testing process mainly consists of 6 steps. The first step is to select the test module; the second step is to pierce the test module, which is usually performed on the test bench; the third step is to select the measurement port, such as selecti...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R31/26
Inventor 连晓谦凌耀君王明陈寒顺许文慧
Owner CSMC TECH FAB2 CO LTD
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