Solder resisting method for circuit board

Abstract

The invention discloses a solder resisting method for a circuit board. The solder resisting method for the circuit board includes the following steps, a step 20 is that a first ink layer is printed in a silk-screen printing mode, more specifically, a silk screen with blocking points is utilized for printing the first ink layer, the blocking points cover holes in the circuit board, each blocking point is 0.13 to 0.17 millimeter longer than the diameter of each hole in the circuit board, and the thickness of the first ink layer is 35 micro meters to 40 micro meters; a step 30 is that a standing process is carried out on the circuit board; a step 40 is that a second ink layer is painted in an electrostatic spraying mode, more specifically, the electrostatic spraying technology is utilized for spraying the second ink layer on the circuit board, the second ink layer covers the first ink layer, and the thickness of the second ink layer is 40 micro meters to 50 micro meters; and a step 50 is that a solder resisting curing process is carried out, more specifically, the first ink layer and the second ink layer are exposed, developed and cured. The solder resisting method for the circuit board integrates the advantages of two solder resisting technologies, namely silk-screen printing and electrostatic spraying, the requirement that no solder resisting ink enters the holes of the circuit board is met, the technological processes are simple, and processing efficiency is high.

Description

technical field [0001] The invention relates to the field of printed circuit board processing, in particular to a circuit board solder resistance method. Background technique [0002] First, the relevant terms in the field of printed circuit board processing are explained: [0003] Solder resistance: Provide a permanent protective film for circuit boards with solder resistance, insulation, physical and chemical protection functions. This protective film can also be used as a carrier for text ink printing and make circuit boards have a beautiful appearance. [0004] Electrostatic spraying process: Using high-efficiency electrostatic characteristics and high-pressure spraying principle, the ink is charged with static electricity and attached to the surface of the circuit board, and the board after the ink is evenly sprayed is pre-baked to achieve the purpose of solder resistance. [0005] Nail bed process: In the solder resist process, copper nails of different specifications...

AI Technical Summary

Problems solved by technology

[0020] The above-mentioned processing methods have the following problems: 1. Single-sided silk screen printing plus manual suction holes have the risk of holes not being sucked clean, and require a lot of manpower, which is not suitable for mass processing at all; 2. Using silk with a higher mesh number The printing process for two or more times is complicated, and the production cost increases sharply; 3. The production plan cannot be achieved normally

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