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A preparation method of nanowire devices based on ordered arrangement of nanowires

A technology of orderly arrangement and nanowires, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of inability to fix nanowires precisely

Inactive Publication Date: 2017-04-05
黄辉 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned arrangement method can control the arrangement direction of the nanowire array, but cannot precisely fix the nanowires at a specific position

Method used

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  • A preparation method of nanowire devices based on ordered arrangement of nanowires
  • A preparation method of nanowire devices based on ordered arrangement of nanowires
  • A preparation method of nanowire devices based on ordered arrangement of nanowires

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] First, a layer of SiO is oxidized on the surface of the silicon substrate 2 thin layer, using SiO 2 The thin layer is used as a mask to prepare a slender groove structure on the surface of the silicon substrate through photolithography and etching processes, such as figure 1 shown;

[0034] Second, SiN is sequentially grown on the groove surface x Insulating film, Cr-Au metal film, and polyimide insulating film, the metal film can be used to heat nanowire devices, such as Figure 7 shown.

[0035] Then, the solution containing GeSi nanowires is dropped on the surface of the substrate, and the arrangement direction of the nanowires is consistent with the direction of the groove through dielectrophoresis, and some nanowires can be trapped in the groove, such as figure 2 shown;

[0036] Then clean the substrate to remove the nanowires outside the groove, leaving only the nanowires in the groove, such as image 3 shown;

[0037] Finally, the electrode structure is p...

Embodiment 2

[0039] First, etch a slender groove structure on the surface of the GaAs substrate, such as figure 1 shown;

[0040] Second, SiN is sequentially grown on the groove surface x Insulating film, Ti-Pt-Ni metal film, and BCB insulating film, wherein the metal film is used to prepare the gate of nanowire transistor, such as Figure 7 shown.

[0041] Then, the solution containing ZnO nanowires is dropped on the surface of the substrate, and the arrangement direction of the nanowires is consistent with the direction of the groove through the electrostatic force, and some nanowires can fall into the groove, such as figure 2 shown;

[0042] Then clean the substrate to remove the nanowires outside the groove, leaving only the nanowires in the groove, such as image 3 shown;

[0043] Finally, the electrode structure is prepared on the nanowire through photolithography and coating processes, such as Figure 4 shown.

Embodiment 3

[0045] First, etch a thin strip groove on the surface of the glass substrate, such as figure 1 shown;

[0046] Then, the solution containing AlInGaAsP nanowires is dropped on the surface of the substrate, and the arrangement direction of the nanowires is consistent with the direction of the groove through the shear force, and some nanowires can fall into the groove, such as figure 2 shown;

[0047] Then clean the substrate to remove the nanowires outside the groove, leaving only the nanowires in the groove, such as image 3 shown;

[0048] Finally, the electrode structure is prepared on the nanowire through photolithography and coating processes, such as Figure 4 shown.

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Abstract

The invention provides a nanowire device preparation method based on nanowire ordered arrangement. The nanowire device preparation method is characterized in that a long and thin strip groove structure is formed on the surface of a substratum through etching, and a groove is used for fixing a nanowire to realize accurate control of nanowire arrangement positions and a thin film can be grown on the surface of the groove to serve as a grid electrode or a heating electrode or an optical reflection lens of a nanowire device. The method has the advantages of being simple in process, and suitable for scale preparation.

Description

technical field [0001] The invention relates to a preparation method of a nanowire device, which can be used for nanowire microelectronic and optoelectronic devices. Background technique [0002] Nanotechnology is considered to be one of the three major science and technologies of the 21st century. Among them, semiconductor nanowires are considered to be the basic structure of future micro-nano devices due to their unique one-dimensional quantum structure [Mater. Today, 9 (2006) 18-27]. In recent years, the research work of semiconductor nanowires has made great progress, and its application fields include integrated circuits [Nature, 470 (2011) 240-244], transistors [Nano Letters, 8 (2008) 925-930], lasers [Science , 292(2001) 1897-1899], single photon devices [Nature Nanotechnology, 5 (2010) 195-199], LEDs [Nano Letters, 6 (2006) 1719-1722,], and solar cells [Nano Lett., 10( 2010) 1082-1087] and so on. [0003] Although semiconductor nanowires have very important applic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02
Inventor 黄辉渠波曹暾
Owner 黄辉