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Scribing method for brittle material substrate

A brittle material substrate and scribing groove technology, which is used in stone processing equipment, fine working devices, glass manufacturing equipment, etc., can solve the problems of edge width limitation, inability to reduce beam width, etc. Effect

Inactive Publication Date: 2016-02-10
MITSUBOSHI DIAMOND IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the beam width cannot be reduced, so the problem that the edge width that can be processed is limited cannot be solved.

Method used

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  • Scribing method for brittle material substrate
  • Scribing method for brittle material substrate
  • Scribing method for brittle material substrate

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Experimental program
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Effect test

Embodiment

[0048]

[0049] figure 2 The relationship between the wavelength and transmittance of laser light (Er fiber laser) irradiated on soda glass having various thicknesses is shown in . In addition, in Table 1, the transmittance and absorptivity of each board thickness are shown. In addition, the absorption rate is a calculated value.

[0050] Table 1 Transmittance and absorptivity of each plate thickness

[0051] Plate thickness / mm

Transmittance

Absorption rate (calculated value)

1.3

55%

45%

1.8

46%

54%

[0052] It can be clearly seen from these charts that in the wavelength range of 2.8 μm to 4.0 μm, for glass substrates with a thickness of 1.3mm (solid line) and 1.8mm (dashed line), the transmittances are 55% and 46%, respectively. The absorption rate is 45% and 54% respectively, and has a certain degree of absorption and permeability. For a substrate having such a thickness, the irradiated laser light is absorbed insi...

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Abstract

PURPOSE: A scribe method of a brittle material substrate is provided to scribe the substrate by a predetermined segment line on the curve by forming a cooling spot and irradiating laser on a laser irradiation spot at the same time. CONSTITUTION: A scribe method of a brittle material substrate comprises the following steps: the laser with the wavelength having absorption and transparency by a brittle material substrate is irradiated and dispersed to a cooling medium, and the laser is irradiated on a laser irradiation spot; and a beam spot by the laser irradiation and the cooling spot by the cooling medium are scanned by the predetermined segment line. In the laser irradiation step, the focus of the laser is positioned within the range of the other side of the surface of the substrate. A scribe method of the brittle material substrate comprises an additional initial crack forming process before the laser irradiation step. In the laser irradiation step, the wavelength of the laser is between 2.7 micrometers and 4.0 micrometers. A scribe apparatus(1) of the brittle material substrate comprises a table(2), a laser generator(3), an optical system, a condensing lens(5), a cooling nozzle(6), and a transport apparatus. [Reference numerals] (10) Table moving unit; (11) Condensing lens moving unit; (3) Laser generator

Description

technical field [0001] The present invention relates to a scribing method for a brittle material substrate, in particular to a scribing method for forming a scribing groove along a dividing line of a brittle material substrate. Background technique [0002] As a method of forming a scribe groove for division on a glass substrate, there is a method of forming a scribe groove by using a laser. In this case, a part of the substrate is melted and evaporated by irradiating laser light along the planned division line, thereby forming the scribe groove. However, in this method, a part of the dissolved or evaporated substrate may adhere to the surface of the substrate, leading to deterioration in quality. In addition, the flaws formed by the dissolved and evaporated parts are the cause of the decrease in the strength of the end surface of the substrate. [0003] Therefore, as another method for dividing a glass substrate, there is provided a method that uses CO absorbed by the sur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/09B23K26/00B23K26/364B28D5/00
CPCB23K26/38B26D3/085C03B33/027C03B33/033C03B33/04C03B33/082C03B33/091Y02P40/57
Inventor 村上政直清水政二
Owner MITSUBOSHI DIAMOND IND CO LTD
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