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Electroless copper plating solution and preparation method therdof

A technology of chemical copper plating and preparation method, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve problems such as hazards and human health hazards, and achieve no harm to the human body, simple ingredients, and a preparation method simple effect

Inactive Publication Date: 2013-06-05
QINGZHOU LONGYU CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the conventional electroless copper plating is harmful to the body, especially the cyanide copper plating brings health hazards and waste disposal problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A kind of electroless copper plating solution, is made up of the composition of following parts by weight:

[0018] 30 parts of copper sulfate, 33 parts of tetrahydroxypropyl ethylenediamine, 20 parts of sodium hypophosphite, 4 parts of dihydroxynitrobenzene, 4 parts of sodium carbonate.

[0019] The preparation method of above-mentioned electroless copper plating solution is:

[0020] (1) Use stainless steel, enamel or plastic containers as plating tanks;

[0021] (2) heating and dissolving copper sulfate with 1 / 3 of the total volume of the plating tank;

[0022] (3) Dissolve tetrahydroxypropylethylenediamine, dihydroxyethylazione, and sodium carbonate with another 1 / 3 of water, then pour the copper sulfate solution into it under stirring, and clarify and filter;

[0023] (4) Dissolve the sodium hypophosphite with the remaining 1 / 3 of water, filter, pour the mixed solution of the above step (3) into it while stirring, and obtain the copper plating solution.

Embodiment 2

[0025] A kind of electroless copper plating solution, is made up of the composition of following parts by weight:

[0026] 25 parts of copper sulfate, 30 parts of tetrahydroxypropyl ethylenediamine, 18 parts of sodium hypophosphite, 3 parts of dihydroxyazone, and 3 parts of sodium carbonate.

[0027] The preparation method is the same as in Example 1.

Embodiment 3

[0029] A kind of electroless copper plating solution, is made up of the composition of following parts by weight:

[0030] 35 parts of copper sulfate, 35 parts of tetrahydroxypropyl ethylenediamine, 22 parts of sodium hypophosphite, 5 parts of dihydroxyazone, and 5 parts of sodium carbonate.

[0031] The preparation method is the same as in Example 1.

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Abstract

The invention discloses an electroless copper plating solution and a preparation method of the electroless copper plating solution. The electroless copper plating solution comprises, by weight, 25-35 parts of copper sulfate, 30-35 parts of quadric-hydroxypropyl quadrol, 18-22 parts of sodium hypophosphite, 3-5 parts of dyhydroxy pyrid and 3-5 parts of sodium carbonate. The an electroless copper plating solution and the preparation method of the electroless copper plating solution has the advantages of being simple in electroless copper plating composition, easy in preparation method, and good in use effect, and harmless to human body, and safe and reliable.

Description

technical field [0001] The invention relates to an electroless copper plating solution, in particular to an electroless copper plating solution and a preparation method thereof, belonging to the field of electroless copper plating solutions. Background technique [0002] Electroless copper plating is a process in circuit board manufacturing, usually also called copper sinking or porosity (PTH), which is an autocatalytic redox reaction. The usual method is to first treat with an activator, so that the surface of the insulating substrate is adsorbed with a layer of active particles, usually metal palladium particles (palladium is a very expensive metal, the price is high and has been rising, in order to reduce costs There are practical colloidal copper processes abroad now), copper ions are first reduced on these active metal palladium particles, and these reduced metal copper crystal nuclei themselves become the catalytic layer of copper ions, so that the reduction reaction o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
Inventor 郭生钰
Owner QINGZHOU LONGYU CHEM TECH
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