44 results about "Tetrahydroxypropyl ethylenediamine" patented technology

The invention relates to cosmetic formulations comprising specific ester quats based on isopropanolamine or tetrahydroxypropyl ethylenediamine, and to the use of these ester quats in cosmetics.

The invention relates to the technical field of nonmetallic surface chemical plating treatment, in particular to a chemical-copper solution. The chemical-copper solution comprises a pre-plating copper solution and a thick copper plating solution. The pre-plating copper solution comprises copper salt, formaldehyde, a first complexing agent, a stabilizing agent, a surface active agent, an accelerant and a pH adjusting agent. The thick copper plating solution comprises copper salt, formaldehyde, a second complexing agent, a stabilizing agent, a surface active agent, an accelerant and a pH adjusting agent. The first complexing agent is a mixture of ethylene diamine tetraacetic acid and tetrahydroxypropyl ethylenediamine. The second complexing agent is a mixture of tartrate and triethanolamine. The chemical-copper solution is stable in performance, convenient to maintain, safe and environmentally friendly; the pre-plating copper solution is high in activity and the thick copper plating solution is good in stability, the pre-plating copper solution and the thick copper plating solution are applied to different stages of the chemical copper plating method respectively, the chemical plating work efficiency is high, obtained plating layers are combined reliably, the yield of copper plating pieces is high, and large-scale industrial production is facilitated.

The invention provides a chemical copper plating solution. The chemical copper plating solution is prepared from, by mass, 1-10 parts of divalent copper salt, 2-50 parts of reducing agent, 20-100 parts of first complexing agent, 0.001-0.02 part of stabilizer and 0.01-2 parts of second complexing agent and/or surfactant; the first complexing agent is selected from one of or a combination of at least two of tartaric acid, tartrate, ethylenediamine tetraacetic acid, ethylenediaminetetraacetic acid, citric acid, citrate, N-hydroxyethyl ethylenediamine triacetic acid, N-hydroxyethyl ethylenediaminetriacetate, triethanolamine, nitrilotriacetic acid and aminotriacetate; the second complexing agent is selected from one of or a combination of at least two of amino acid, amino acid derivatives, benzothiazole, benzothiazole derivatives, selenium cyanate, tetrahydroxypropyl ethylenediamine and phenanthroline. The chemical copper plating solution can effectively solve the problem that the surfaceof rolled copper foil obtained after electroplating is rough.

The invention relates to a super-early-strength fluorine-free alkali-free liquid accelerator and a preparation method thereof. The accelerator is prepared from the following raw materials: aluminum sulfate, an organic dissolution promoter, a stabilizer, an early strength agent, a pH regulator and water. The organic dissolution promoter is formed by mixing a component A, a component B and a component C, wherein the component A is monoethanolamine, diethanolamine or triethanolamine; the component B is N-methyldiethanolamine, N,N-dimethylethanolamine or N,N-dimethylformamide; and the component C is diethylenetriamine, triethylene tetramine or tetrahydroxypropyl ethylenediamine. The stabilizer is selected from superfine sepiolite and pseudo-boehmite. The pH regulator is selected from p-toluenesulfonic acid, oxalic acid and formic acid. The early strength agent is selected from lithium sulfate, magnesium sulfate, nanometer silica sol and nanometer aluminum sol. The super-early-strength fluorine-free alkali-free liquid accelerator is good in performance, simple in preparation process, free of fluorine, alkali and chlorine and capable of meeting the performance requirements of various setting accelerator standards for alkali-free accelerators; and according to the liquid accelerator, compressive strength within 6 hours is far larger than 2.5 MPa, compressive strength within 1 day is far larger than 15.0 MPa, a compressive strength retention rate within 90 days is larger than or equal to 110%, and stability exceeds 9 months.

The invention discloses a cyanide-free alkaline copper plating electroplating solution. The electroplating solution is mainly prepared by mixing the following components of, by weight, 1 g/L-60 g/L ofN,N,N'-Tris(2-Hydroxypropyl)-N'-hydroxyethyl ethylenediamine, 0 g/L-8 g/L of tetrahydroxypropyl ethylenediamine, 0 g/L-0. 6 g/L of 1,3-Dibromo-5,5-dimethylhydantoin, 25 g/L- 45g/L of sodium citrate and/or tartrate, 20 g/L-50 g/L of copper salt, 50 g/L-70 g/L of inorganic alkali, 20 g/L-120 g/L of conductive salt, and the balance wate. At least one of the 1,3-Dibromo-5,5-dimethylhydantoin and thetetrahydroxypropyl ethylenediamine need to be picked out. The cyanide-free alkaline copper plating electroplating solution has relatively strong dispersion capability.

The invention relates to an electroless copper plating method for carbon fibers. The electroless copper plating method comprises the steps of carbon fiber preprocessing and electroless copper plating. In the preprocessing step, an acetone method is mainly used for ungluing, and the carbon fibers are processed through a sensitization and activation one-step method. In the electroless copper plating step, a plating solution is mainly composed of copper sulfate pentahydrate, tetrahydroxypropyl ethylenediamine, edta disodium, formaldehyde, bispyridine, potassium ferrocyanide and PEG-100. The pH value is controlled within 10-13. By means of the electroless copper plating method, copper-coated carbon fibers can be quickly obtained, a copper plating layer and the carbon fibers are tightly combined, and the plating layer is even and can reach a certain thickness. The combining capacity between the carbon fibers and the copper plating layer can be improved, and therefore the carbon fibers can adapt to a poor working condition of a wind driven generator.

A method of treating a hoof of an ungulate animal. The method comprises coating one or both of (i) at least a portion of a bottom surface of the hoof or (ii) at least a portion of a block surface with a curable polymer and allowing the polymer to cure for a period of time. The polymer is cured within 60 seconds or less of the coating and the cured polymer has a Shore D hardness of about 10 to about 50. The curable polymer is provided as a two component system. The first component is a reaction product of (a) comprises 4-4′-diphenylmethane-diisocyanate, castor oil, isocyanatopropyltriethoxysilane, and glycidoxypropyltrimethoxysilane, and wherein (b) comprises dicyclohexylmethane-4,4-diisocyanate, polyether polyol, 4,4′-diphenylmethane-diisocyanate (MDI), and triethoxy(3-isocyanatopropyle)silane. The second component comprises polyoxypropylene oxide ether polyol, diol (2000 MW), polyxoypropylene oxide ether polyol, triol (450 MW), tetrahydroxypropylethylendiamine, metaxylenediamine, and organobismuth catalyst.

The invention discloses a low-residual and low-corrosivity aluminum soft soldering tin paste and a manufacturing method of the low-residual and low-corrosivity aluminum soft soldering tin paste. The aluminum soft soldering tin paste is composed of tin-based solder alloy powder and soldering flux. The tin-based solder alloy powder accounts for 75.0-90.0% of the weight of the tin paste. The soldering flux comprises, by weight, 6.0-21.0% of tetrahydroxypropyl ethylenediamine hydrofluoride, 0.5-5.0% of metal salt film-forming agent, 0.2-4.0% of organic thickening agent, 0.2-2.0% of thixotropic agent and 0.01-0.25% of corrosion inhibitor. The tin paste has the advantages of being good in spreadability, small in post-welding residual quantity, low in corrosivity and the like, and is suitable for soldering of electronic and electrical appliances and aluminum structures and parts in the household appliance industry and especially suitable for direct surface mounting welding of board-level-packaged chip assemblies and aluminum radiating substrates in LED lighting and soldering of aluminum radiators or heat exchange equipment, the automation of the welding process can be easily achieved, and the high radiating efficiency and high reliability of weldments can be obtained.

The invention discloses a polymer grinding aid for cement and a preparation method of the grinding aid. The grinding aid for the cement is prepared from the following raw materials, in percentages bymass: 4-9% of tetrahydroxyethyl ethylenediamine, 0.5-0.8% of a dispersing agent, 15-27% of crude glycerin, 3-10% of sugar, 7-15% of sodium thiosulfate, 0.3-0.5% of polyvinyl alcohol, 3-8% of tetrahydroxypropyl ethylenediamine, and the balance of water, wherein a sum is 100%. According to the grinding aid provided by the invention, the tetrahydroxyethyl ethylenediamine and the tetrahydroxypropyl ethylenediamine are used to replace triethanolamine and triisopropanolamine, the high-dispersion polycarboxylate and/or fatty alcohol polyoxyethylene ether dispersant is used, firstly cement particles can be highly dispersed, and through dispersion permeation, electrical charges carried by the cement particles are neutralized to reduce agglomeration; and the grinding aid has good chemical stability,does not contain halogen ions capable of corroding equipment, significantly improves grinding efficiency and early and late strength of the cement, and can significantly reduce energy consumption ofproduction of the cement by 20-30% in the presence of the tetrahydroxyethyl ethylenediamine and the tetrahydroxypropyl ethylenediamine.

The invention discloses a high-activity chemical copper plating solution and a chemical copper plating method. The high-activity chemical copper plating solution is characterized by mainly consisting of copper salt, a reducing agent, a complexant, a pH regulator and a combined additive, wherein the complexant is one or combination of several of ethylenediamine tetraacetic acid, sodium potassium tartrate, sodium citrate, N-(2-hydroxyethyl)ethylenediaminetriacetic acid, tetrahydroxypropyl ethylenediamine, triethanolamine and nitrilotriacetic acid; the combined additive is combination of N and/or S-containing additives. The high-activity chemical copper plating solution has the advantages of being high plating solution activity, low in operation temperature, good in stability and particularly suitable for the chemical copper plating of surfaces of nonmetal matrixes which are relatively weak in activation degree.

The invention discloses an electroless copper plating solution and a preparation method of the electroless copper plating solution. The electroless copper plating solution comprises, by weight, 25-35 parts of copper sulfate, 30-35 parts of quadric-hydroxypropyl quadrol, 18-22 parts of sodium hypophosphite, 3-5 parts of dyhydroxy pyrid and 3-5 parts of sodium carbonate. The an electroless copper plating solution and the preparation method of the electroless copper plating solution has the advantages of being simple in electroless copper plating composition, easy in preparation method, and good in use effect, and harmless to human body, and safe and reliable.

The invention discloses a formula of a chemical copper deposition liquid. The chemical copper deposition liquid consists of the following components: 9-12g/L copper sulfate, 30-32g/L disodium edetate dehydrate, 15-16g/L tetrahydroxypropyl ethylenediamine, 12-15g/L sodium hydroxide, 0.09-0.1g/L potassium ferricyanide, 0.01-0.03g/L potassium ferrocyanide and 12-15g/L formaldehyde. The invention provides the formula of the chemical copper deposition liquid with high stability and good elongation.

The invention belongs to the technical field of cosmetics, and discloses a formula for removing acnes and recovering skin metabolism and a preparation method of the formula. The formula comprises a preparation A, a preparation B, a preparation C and a preparation D, wherein the preparation A contains water, propanediol and hydroxyacetophenone; the preparation B contains an acrylic acid (ester)/C10-30 alkanol acrylate cross-linked polymer and a hydroxyethyl cellulose composition; the preparation C contains tetrahydroxypropyl ethylenediamine and a salicylic acid composition; and the preparation D contains panthenol, water, nicotinamide, centella asiatica extract, dipotassium glycyrrhizinate, a menthol lactate composition and a 1,2-hexanediol and butanediol composition. The product can treat acnes induced by various reasons, and the formula regulates hormone secretion and inhibits excessive generation of sebum during using; epidermal cutin is removed, pores are dredged, and sebum accumulation is prevented; the autophagy function of cells is enhanced, excessive propagation of bacteria and acne-causing bacteria is inhibited, and the microecological balance of epidermis is maintained; and production of endothelin is activated, and the skin inflammatory reaction caused by acnes is relieved.

The invention belongs to the field of electronic devices and particularly relates to chemical copper plating liquid applied to a zinc oxide pressure sensitive resistor copper electrode and a copper plating technique thereof. The chemical copper plating liquid comprises copper sulfate, EDTA and/or EDTA disodium, tetrahydroxypropyl ethylenediamine, disodium edetate dihydrate, sodium hydroxide, sodium monophosphate, hydrazine hydrate, 2,2'-bipyridyl, a surface active agent, an accelerator and an antioxidant. A material obtained through a preparation method and used for preparing a zinc oxide pressure sensitive resistor is excellent in performance, the chemical copper plating liquid does not contain a toxic substance, namely formaldehyde, the production process is environmentally friendly, theuniformity, corrosion resistance, hardness and weldability of a prepared plated layer are excellent, and combination of the plated layer and zinc oxide is firm.

The invention provides a skin care product special for sun protection. The skin care product comprises the following raw materials in parts by weight: 4-5.2 parts of a whitening agent, 5-7 parts of anemulsifier, 12-14 parts of grease, 0.8-1.2 parts of a thickening agent, 0.2-0.36 part of a preservative, 2-4 parts of propylene glycol, 6-8 parts of betaine, 1.5-3.3 parts of oat dextran, 0.6-0.9 part of allantoin, 13-16 parts of a humectant, 1.2-2.4 parts of ceramide, 5.5-12.5 parts of an oil phase composition and 0.08-0.12 part of tetrahydroxypropylethylenediamine, 2-4 parts of oligopeptide, 8-12 parts of aloe, and 20-30 parts of deionized water. The invention also provides a preparation method of a whitening and sunscreen skin care product, and the obtained skin care product has the effects of whitening and lightening spots, resisting oxidation, scavenging free radicals, moisturizing, reducing the damage of ultraviolet rays to skin, and the like.

A method for removing SO2 in gas is characterized in that tetrahydroxyethyl-ethylene diamine or tetrahydroxypropyl-ethylene diamine, H3PO4 and the like are subjected to molar reaction to generate ammonium salt water solution serving as an absorbent, the absorbent contacts with the gas containing the SO2 to remove the SO2 by absorption, the molar concentration of the ammonium salt water solution serving as the absorbent is 0.2-0.5mol/L, the volume concentration of the SO2 in the absorbed gas is 0.5-99%, absorption temperature is 0-70 DEG C, the saturated ammonium salt water solution desorbs the SO2 by heating under normal pressure after absorbing the SO2, so that the saturated ammonium salt water solution can be reused, SO2 desorption temperature is 70-102 DEG C, and SO2 desorption time is 20-120 minutes. Compared with the prior art, the method has the advantages that the absorbent is good in desulfurization performance and recycling performance, the saturated absorbent easily desorbs the SO2 after absorbing the SO2, and the absorbent is easily dissolved in water and free from saturated vapor pressure and avoids the problems of equipment blockage due to scaling and the like.

The invention relates to a chemical copper plating solution and a preparation method and application thereof. The chemical copper plating solution comprises, by mass concentration, 5-20 g/kg of copper sulfate pentahydrate, 2-20 g/kg of a reducing agent, 20-100 g/kg of a complexing agent, 0.001-0.02 g/kg of a stabilizer, 0.001-0.02 g/kg of a flexibilizer, 0.001-0.02 g/kg of an accelerator, 10-20 g/kg of a pH adjusting agent and deionized water which are dissolved in deionized water; and the complexing agent is tetrahydroxypropyl ethylenediamine. The chemical copper plating solution is high in activity and good in stability, and a metal copper grid can be formed by the chemical copper plating solution to replace traditional ITO.