Cyanide-free alkaline copper plating solution

A cyanide-free alkaline copper plating and electroplating solution technology, applied in the field of electroplating, can solve problems such as inability to meet demand, too large thickness difference, etc., and achieve the effects of high uniformity and high dispersion ability

Active Publication Date: 2019-08-09
GUANGZHOU SANFU NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the traditional cyanide-free alkali copper plating solution cannot meet the demand due to the large thickness difference between the high area and the low area on the device.

Method used

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  • Cyanide-free alkaline copper plating solution
  • Cyanide-free alkaline copper plating solution
  • Cyanide-free alkaline copper plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] Components and concentrations shown in Table 1 and Table 2 are used to configure the cyanide-free alkaline copper plating electroplating solution, and the concentration of the electroplating solution is 1000ml / L, and then use the electroplating solution to carry out electroplating according to the existing method.

[0082] (1) The preparation method of cyanide-free alkaline copper plating electroplating solution (embodiment 1-embodiment 8):

[0083] Dissolve each complexing agent, copper salt, conductive salt and inorganic base in water according to the components and their concentrations in Table 1 and Table 2, and stir and mix evenly to obtain a cyanide-free alkaline copper plating solution.

[0084] The cyanide-free alkaline copper plating electroplating solution of Comparative Example 1 was prepared according to the components and concentrations thereof in Comparative Example 1.

[0085] Table 1

[0086]

[0087] Table 2

[0088]

[0089]

Embodiment 2

[0101] The aluminum alloy filter can be electroplated according to the following steps by using the existing method.

[0102] (1) Degreasing: 5 minutes at 55°C

[0103] (2) Alkali etching: 50°C for 30 seconds

[0104] (3) Descaling: 90 seconds at 25°C

[0105] (4) Zinc precipitation: 55 seconds at 25°C

[0106] (5) Dezincification: 60 seconds at room temperature

[0107] (6) Zinc precipitation: 25°C for 40 seconds

[0108] (7) Electroplating using the cyanide-free alkaline copper plating solution of Example 4: 1.5A / dm for 40 minutes at 55°C 2

[0109] (8) Burnt copper: 55°C for 20 minutes

[0110] (9) Silver plating: 4 minutes at 28°C

[0111] (10) Silver protection: 45°C for 4-5 minutes

[0112] (11) drying

[0113] (12) Inspection and storage

[0114] All sides of the filter obtained by the above method have a uniform thickness. The thickness difference between the high area and the low area of ​​the workpiece is less than 3 times. After 40 minutes of electroplati...

Embodiment 3

[0116] (1) Thermal shock experiment

[0117] Bake the filter obtained in Example 2 at 220°C, take it out after 60 minutes, put it into cold water immediately, and take it out for observation after 10 minutes. There is no blistering or peeling of the part.

[0118] (2) File experiment

[0119] Utilize a four-inch file to file the edge of the filter obtained in Example 2 along the direction of the metal substrate to the deposition layer and the plating layer at an angle of 45° to remove the deposition layer. It is observed that the deposition layer is not separated from the metal substrate.

[0120] It shows that the above-mentioned electroplating solution not only has a high dispersion ability, but also has a high binding force between the coating and the substrate.

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Abstract

The invention discloses a cyanide-free alkaline copper plating electroplating solution. The electroplating solution is mainly prepared by mixing the following components of, by weight, 1 g / L-60 g / L ofN,N,N'-Tris(2-Hydroxypropyl)-N'-hydroxyethyl ethylenediamine, 0 g / L-8 g / L of tetrahydroxypropyl ethylenediamine, 0 g / L-0. 6 g / L of 1,3-Dibromo-5,5-dimethylhydantoin, 25 g / L- 45g / L of sodium citrate and / or tartrate, 20 g / L-50 g / L of copper salt, 50 g / L-70 g / L of inorganic alkali, 20 g / L-120 g / L of conductive salt, and the balance wate. At least one of the 1,3-Dibromo-5,5-dimethylhydantoin and thetetrahydroxypropyl ethylenediamine need to be picked out. The cyanide-free alkaline copper plating electroplating solution has relatively strong dispersion capability.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a cyanide-free alkaline copper plating electroplating solution. Background technique [0002] In the electroplating industry, alkaline copper plating is mainly used for the base coating of iron parts, zinc alloy parts, aluminum alloy parts, brass parts and other substrates. The complexing agent of the traditional alkaline copper plating solution uses cyanide, and it has been widely used since the First World War. Cyanide copper plating has superior performance, low porosity, good dispersion ability, good deep plating ability, and stable plating solution. However, cyanide is a highly toxic substance, and its lethal dose is only 5 mg. It not only has potential safety hazards during use, but also The post-treatment of wastewater is also extremely complicated, which brings huge economic pressure to enterprises. Therefore, it is necessary to develop a cyanide-free copper plat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 田志斌谢丽虹詹益腾邓正平
Owner GUANGZHOU SANFU NEW MATERIALS TECH
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