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Solder composition for precoating, method for manufacturing printed circuit board, solder composition, and method for manufacturing electronic substrate

A technology for printed wiring substrates and manufacturing methods, which is applied in the fields of assembling printed circuits with electric components, manufacturing printed circuits, printed circuits, etc., which can solve problems such as insufficient solder wettability, and achieve excellent solder wettability and storage stability , Inhibition of solder balls, excellent effect of solder wettability

Active Publication Date: 2018-10-23
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the lead-free solder paste for precoating described in Document 1 is used, pores that are not wetted by the solder may occur on the electrode, and the solder wettability is not sufficient.

Method used

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  • Solder composition for precoating, method for manufacturing printed circuit board, solder composition, and method for manufacturing electronic substrate
  • Solder composition for precoating, method for manufacturing printed circuit board, solder composition, and method for manufacturing electronic substrate
  • Solder composition for precoating, method for manufacturing printed circuit board, solder composition, and method for manufacturing electronic substrate

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Experimental program
Comparison scheme
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no. 1 approach

[0028] First, a first embodiment of the present invention will be described.

[0029] Hereinafter, embodiment of the solder composition for precoat layers of this embodiment, and the manufacturing method of a printed wiring board are demonstrated.

[0030] [Solder composition]

[0031] The solder composition for precoats of this embodiment contains the flux composition demonstrated below, and (D) solder powder demonstrated below.

[0032] First, the flux composition used in this embodiment will be described.

[0033] The flux composition used in the present embodiment contains (A) rosin-based resin, (B) activator, and (C) solvent described below.

[0034] [(A) ingredient]

[0035] Examples of the (A) rosin-based resin used in the present embodiment include rosin-based and rosin-based modified resins. Examples of rosins include gum rosin, wood rosin, tall oil rosin, disproportionated rosin, polymerized rosin, hydrogenated rosin, derivatives thereof, and the like. Examples ...

no. 2 approach

[0081] Next, a second embodiment of the present invention will be described.

[0082] The solder composition of this embodiment contains the flux composition demonstrated below, and (E) solder powder demonstrated below.

[0083] [Solder composition]

[0084] First, the flux composition used in this embodiment will be described. The flux composition used in this embodiment is a component other than solder powder in a solder composition, and contains (A) rosin-based resin, (B) activator, (C) solvent, and (D) thixotropic agent.

[0085] [(A) ingredient]

[0086] Examples of the (A) rosin-based resin used in the present embodiment include rosin-based and rosin-based modified resins. Examples of rosins include gum rosin, wood rosin, tall oil rosin, and the like. Examples of rosin-based modified resins include: disproportionated rosin, polymerized rosin, hydrogenated rosin (completely hydrogenated rosin, partially hydrogenated rosin, aliphatic unsaturated monobasic acid such as ...

Embodiment 1-1

[0164] As a flux composition, 40% by mass of rosin resin A, 10% by mass of rosin resin B, 14% by mass of amine activator A, 2.6% by mass of organic acid A, 0.6% by mass of organic acid B, and halogen activator A 0.5% by mass, 0.3% by mass of the halogen-based activator B, 8% by mass of the thixotropic agent, and 24% by mass of the solvent were appropriately mixed to obtain a flux composition.

[0165] Moreover, 30 mass % of the obtained flux composition, 35 mass % of solder powder A, and 35 mass % of solder powder B (total 100 mass %) were mix|blended and mixed suitably, and the solder composition was prepared.

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Abstract

The invention provides a solder composition for precoating, the solder composition comprises a welding flux composition and (D) solder powder, the welding flux composition contains (A) rosin resin, (B) an active agent and (C) a solvent, wherein (B) component contains (B1)N, N, N', N'-tetrakis(2-hydroxypropyl)ethylenediamine, and in the (D) component, particles with a particle size of 5 [mu]m or less is more than 40% volume%.

Description

technical field [0001] The invention relates to a solder composition for a precoat layer and a method for producing a printed wiring board. Moreover, this invention also relates to the manufacturing method of the solder composition used for reflow soldering, and an electronic board|substrate. Background technique [0002] In printed wiring boards, a solder film (precoat) may be formed on electrodes from the viewpoint of preventing electrode surface oxidation. Therefore, as a method for forming such a precoat layer, for example, a method may be employed in which a solder composition for a precoat layer is printed on an electrode of a printed wiring board, and then a reflow process is performed to form a precoat layer on the electrode. layer. In addition, as a solder composition for precoat, for example, a lead-free solder for precoat containing 60 to 85% by weight of Sn-based lead-free solder powder (a) and 15 to 40% by weight of solder (b) has been proposed. Paste, the Sn...

Claims

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Application Information

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IPC IPC(8): B23K35/36B23K37/00H05K3/34B23K101/42
CPCB23K35/3613B23K37/00H05K3/3489
Inventor 饭岛纪成木村瞳原拓生酒井悠希柴崎正训石垣幸一臼仓伸一吉泽慎二岩渕充
Owner TAMURA KK
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