High-activity chemical copper plating solution and chemical copper plating method

An electroless copper plating, high-activity technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of difficult metallization of electroless copper plating solution, decrease of stability of plating solution, etc. Good stability and high activity effect

Inactive Publication Date: 2015-04-29
广东致卓环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although palladium-free activation reduces the cost of activation, it brings challenges to the subsequent electroless copper plating. Conventional electroless copper plating solutions are difficult to achie

Method used

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  • High-activity chemical copper plating solution and chemical copper plating method
  • High-activity chemical copper plating solution and chemical copper plating method
  • High-activity chemical copper plating solution and chemical copper plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This example uses the highly active electroless copper plating solution of invention to carry out electroless copper plating to low palladium activation process, concrete operation is as follows:

[0024] Pretreatment of the substrate: the substrate used in this example does not contain active ingredients, and the substrate is divided into smooth and rough parts. The substrate is activated in the ionic palladium activation solution to achieve a low palladium activation process for the rough part (the smooth part has no activation effect). After activation The palladium (0.08) on the surface of the substrate is much smaller than the colloidal palladium activation (0.46).

[0025] Electroless Copper Plating:

[0026] The composition and process of the electroless copper plating solution are as follows: the concentration of copper sulfate is 8g / L-20g / L, the concentration of formaldehyde is 5-20mL / L, and the complexing agent is disodium edetate and tetrahydroxypropyl ethyle...

Embodiment 2

[0029] This example uses the highly active electroless copper plating solution of invention to carry out electroless copper plating to non-palladium activation process, concrete operation is as follows:

[0030] Pre-treatment of the substrate: The substrate in this example uses catalytic Cu as the active component, does not contain metal palladium, and uses laser ablation to process graphics or patterns on the surface of the substrate, and only the laser-treated part exposes the catalytic copper.

[0031] Electroless Copper Plating:

[0032] The composition and process of the electroless copper plating solution are as follows: the concentration of copper sulfate is 8g / L-20g / L, the concentration of formaldehyde is 5-20mL / L, and the complexing agent is disodium edetate and tetrahydroxypropyl ethylenediamine According to the composition of 1:1-1:3, the concentration of complexing agent is 10-40g / L, the pH value is 11-13, the combined additive is 10-20mL / L, the temperature is 40°C...

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PUM

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Abstract

The invention discloses a high-activity chemical copper plating solution and a chemical copper plating method. The high-activity chemical copper plating solution is characterized by mainly consisting of copper salt, a reducing agent, a complexant, a pH regulator and a combined additive, wherein the complexant is one or combination of several of ethylenediamine tetraacetic acid, sodium potassium tartrate, sodium citrate, N-(2-hydroxyethyl)ethylenediaminetriacetic acid, tetrahydroxypropyl ethylenediamine, triethanolamine and nitrilotriacetic acid; the combined additive is combination of N and/or S-containing additives. The high-activity chemical copper plating solution has the advantages of being high plating solution activity, low in operation temperature, good in stability and particularly suitable for the chemical copper plating of surfaces of nonmetal matrixes which are relatively weak in activation degree.

Description

technical field [0001] The invention relates to the technical field of electroless plating solutions, in particular to a highly active electroless copper plating solution. Background technique [0002] Electroless copper plating has a wide range of applications in the metallization of holes in printed circuit boards (PCBs), the metallization of plastic and ceramic surfaces, and the preparation of electromagnetic shielding materials. Electroless plating is a metal deposition process in which metal ions are reduced under the self-catalysis of the metal surface by an appropriate reducing agent in the solution. Electroless plating can only be performed on a catalytically active surface. [0003] The traditional non-metallic surface activation method uses colloidal palladium, but the stability of the colloid is poor, and the price of palladium is high, resulting in high activation costs. As a result, a series of low-palladium and palladium-free (palladium-free) processes have gr...

Claims

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Application Information

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IPC IPC(8): C23C18/40
CPCC23C18/40
Inventor 范小玲孔德龙梁韵锐李宁宗高亮王群
Owner 广东致卓环保科技有限公司
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