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Chemical copper plating solution

A technology of electroless copper plating and divalent copper, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve problems such as unevenness, heavy structure, rough surface, etc., and achieve no blistering and improved The effect of rough surface and low internal stress

Active Publication Date: 2018-09-21
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The reason why calendered copper foil is more prone to surface roughness after electroplating than electrolytic copper foil is that the crystals of the latter are arranged neatly, and the surface formed after the coating and final surface treatment is relatively flat; Crystallization, although the ductility is good, but irregular cracks and uneven structures will appear on the surface of copper foil

Method used

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  • Chemical copper plating solution
  • Chemical copper plating solution
  • Chemical copper plating solution

Examples

Experimental program
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Effect test

Embodiment 1

[0062] The present embodiment provides a kind of electroless copper plating liquid, by mass concentration, comprises following component:

[0063] Copper sulfate pentahydrate 5g / L, formaldehyde 3g / L, potassium sodium tartrate 30g / L, glycine 0.5g / L and stabilizer;

[0064] Wherein, the solvent is deionized water, the stabilizer consists of 0.001g / L of thiourea, 0.0001g / L of bipyridyl and 0.001g / L of potassium tetracyanonickel (II) hydrate, and the solution is made of sodium hydroxide Adjust the pH to 11.

[0065] The copper deposition rate of the electroless copper plating solution provided in this example is 0.63 μm / 6min during plating; the copper deposition layer is well combined with the PI film, and there is no bubble phenomenon; the rolled copper foil flexible PCB after electroless copper plating and electroplating The surface roughness test results of the board are as follows Figure 1a As shown, its surface is bright without white spots.

Embodiment 2

[0071] The present embodiment provides a kind of electroless copper plating liquid, by mass concentration, comprises following component:

[0072] Copper sulfate pentahydrate 8g / L, formaldehyde 5g / L, sodium citrate 60g / L, iminodiacetic acid 0.8g / L and stabilizer;

[0073] Wherein, the solvent is deionized water, the stabilizer consists of 0.001g / L of thiourea, 0.0001g / L of bipyridyl and 0.001g / L of potassium tetracyanonickel (II) hydrate, and the solution is made of sodium hydroxide Adjust the pH to 11.5.

[0074] The copper deposition rate of the electroless copper plating solution provided in this example is 0.58 μm / 6min during plating; the copper deposition layer is well combined with the PI film, and there is no bubble phenomenon; the rolled copper foil flexible PCB after electroless copper plating and electroplating The surface roughness test results of the board are as follows Figure 2a As shown, its surface is bright without white spots.

Embodiment 3

[0079] The present embodiment provides a kind of electroless copper plating liquid, by mass concentration, comprises following component:

[0080] Copper sulfate pentahydrate 10g / L, sodium hypophosphite 30g / L, disodium edetate 40g / L, 2-mercaptobenzothiazole 0.01g / L and stabilizer;

[0081] Wherein, the solvent is deionized water, the stabilizer consists of 0.001g / L of thiourea, 0.0001g / L of bipyridyl and 0.001g / L of potassium tetracyanonickel (II) hydrate, and the solution is made of sodium hydroxide Adjust pH to 12.

[0082] The copper deposition rate of the electroless copper plating solution provided in this example is 0.65 μm / 6min during plating; the copper deposition layer is well combined with the PI film, and there is no bubble phenomenon; the rolled copper foil flexible PCB after electroless copper plating and electroplating The surface roughness test results of the board are as follows Figure 3a As shown, its surface is bright without white spots.

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Abstract

The invention provides a chemical copper plating solution. The chemical copper plating solution is prepared from, by mass, 1-10 parts of divalent copper salt, 2-50 parts of reducing agent, 20-100 parts of first complexing agent, 0.001-0.02 part of stabilizer and 0.01-2 parts of second complexing agent and / or surfactant; the first complexing agent is selected from one of or a combination of at least two of tartaric acid, tartrate, ethylenediamine tetraacetic acid, ethylenediaminetetraacetic acid, citric acid, citrate, N-hydroxyethyl ethylenediamine triacetic acid, N-hydroxyethyl ethylenediaminetriacetate, triethanolamine, nitrilotriacetic acid and aminotriacetate; the second complexing agent is selected from one of or a combination of at least two of amino acid, amino acid derivatives, benzothiazole, benzothiazole derivatives, selenium cyanate, tetrahydroxypropyl ethylenediamine and phenanthroline. The chemical copper plating solution can effectively solve the problem that the surfaceof rolled copper foil obtained after electroplating is rough.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to an electroless copper plating solution. Background technique [0002] Printed circuit boards (PCBs) can be divided into three types: rigid circuit boards, flexible (or flexible) circuit boards, and soft-hard circuit boards according to the folding resistance of their laminated materials. Among them, the surface conductive material of rigid circuit board is usually electrolytic copper foil; and the surface conductive material of flexible circuit board is usually rolled copper foil, mainly because rolled copper foil has good ductility and other characteristics. Rigid-flex boards use electrolytic copper foil or rolled copper foil as the surface conductive material as required. [0003] Hole metallization (PTH) and electroplating copper are two necessary steps to make circuit boards. Among them, electroless copper plating is one of the commonly used meth...

Claims

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Application Information

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IPC IPC(8): C23C18/40
CPCC23C18/40C23C18/405
Inventor 李晓红宋通章晓冬刘江波童茂军
Owner GUANGDONG SKYCHEM TECH LTD
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