Chemical copper plating liquid applied to zinc oxidepressure sensitive resistor copper electrode and copper plating technique thereof

A varistor, chemical copper plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problem of poor stability of chemical copper plating solution, not meeting energy saving and environmental protection, coating uniformity, Corrosion resistance, hardness, insufficient weldability, etc., to achieve the effect of excellent weldability, excellent performance, and firm bonding

Inactive Publication Date: 2018-08-31
JIANGSU SHIRUI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the reducing agent that the electroless copper plating liquid of this invention adopts is formaldehyde, does not satisfy the requirement of energy saving and environmental protection
[0005] The invention patent with application number 201110348879.5 discloses an electroless copper plating solution on the surface of zinc alloy and its copper plating process. The electroless copper plating solution includes: copper sulfate pentahydrate 5-7g/L, com...

Method used

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  • Chemical copper plating liquid applied to zinc oxidepressure sensitive resistor copper electrode and copper plating technique thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An electroless copper plating solution applied to copper electrodes of zinc oxide varistors, comprising the following components: copper sulfate 10g / L, EDTA 6g / L, tetrahydroxypropyl ethylenediamine 4g / L, ethylenediaminetetraacetic acid di Sodium 7g / L, sodium hydroxide 70g / L, sodium hypophosphite 4g / L, hydrazine hydrate 10mg / L, 2,2'-bipyridine 90mg / L, surfactant 2g / L, accelerator 2g / L, pH regulator 4g / L and antioxidant 1g / L.

[0019] Described surfactant is stearic acid.

[0020] A copper plating process applied to an electroless copper plating solution for copper electrodes of zinc oxide varistors, comprising the following steps: step 1, carrying out pickling treatment of zinc oxide varistor ceramic substrates successively, followed by deionized water and ethanol Cleaning and drying treatment; step 2, preparing an electroless copper plating solution and ultrasonic treatment to obtain an electroless copper plating dispersion; step 3, at room temperature, putting the zin...

Embodiment 2

[0024] An electroless copper plating solution applied to copper electrodes of zinc oxide varistors, comprising the following components: copper sulfate 15g / L, disodium EDTA 8g / L, tetrahydroxypropyl ethylenediamine 8g / L, ethylenediamine Disodium tetraacetate 11g / L, sodium hydroxide 100g / L, sodium hypophosphite 10g / L, hydrazine hydrate 20mg / L, 2,2'-bipyridine 90-110mg / L, surfactant 6g / L, Agent 8g / L, pH adjuster 8g / L and antioxidant 3g / L.

[0025] The surfactant is sodium dodecylbenzenesulfonate.

[0026] A copper plating process applied to an electroless copper plating solution for copper electrodes of zinc oxide varistors, comprising the following steps: step 1, carrying out pickling treatment of zinc oxide varistor ceramic substrates successively, followed by deionized water and ethanol Cleaning and drying treatment; step 2, preparing an electroless copper plating solution and ultrasonic treatment to obtain an electroless copper plating dispersion; step 3, at room temperature...

Embodiment 3

[0030] An electroless copper plating solution applied to copper electrodes of zinc oxide varistors, comprising the following components: copper sulfate 12g / L, disodium EDTA 7g / L, tetrahydroxypropyl ethylenediamine 7g / L, ethylenediamine Disodium tetraacetate 9g / L, sodium hydroxide 90g / L, sodium hypophosphite 8g / L, hydrazine hydrate 12.8mg / L, 2,2'-bipyridine 112.5mg / L, surfactant 4g / L, Agent 6g / L, pH adjuster 7g / L and antioxidant 2.5g / L.

[0031] The surfactant is fatty acid glyceride.

[0032] A copper plating process applied to an electroless copper plating solution for copper electrodes of zinc oxide varistors, comprising the following steps: step 1, carrying out pickling treatment of zinc oxide varistor ceramic substrates successively, followed by deionized water and ethanol Cleaning and drying treatment; step 2, preparing an electroless copper plating solution and ultrasonic treatment to obtain an electroless copper plating dispersion; step 3, at room temperature, putting ...

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PUM

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Abstract

The invention belongs to the field of electronic devices and particularly relates to chemical copper plating liquid applied to a zinc oxide pressure sensitive resistor copper electrode and a copper plating technique thereof. The chemical copper plating liquid comprises copper sulfate, EDTA and/or EDTA disodium, tetrahydroxypropyl ethylenediamine, disodium edetate dihydrate, sodium hydroxide, sodium monophosphate, hydrazine hydrate, 2,2'-bipyridyl, a surface active agent, an accelerator and an antioxidant. A material obtained through a preparation method and used for preparing a zinc oxide pressure sensitive resistor is excellent in performance, the chemical copper plating liquid does not contain a toxic substance, namely formaldehyde, the production process is environmentally friendly, theuniformity, corrosion resistance, hardness and weldability of a prepared plated layer are excellent, and combination of the plated layer and zinc oxide is firm.

Description

technical field [0001] The invention belongs to the field of electronic devices, and in particular relates to an electroless copper plating liquid applied to copper electrodes of zinc oxide piezoresistors and a copper plating process thereof. Background technique [0002] The varistor is a voltage limiting type of protection period. Utilizing the nonlinear characteristics of the varistor, when an overvoltage occurs between the two poles of the varistor, the varistor can clamp the voltage to a relatively fixed voltage value, never realizing the protection of the subsequent circuit. In recent years, with the rapid development of information technology, the miniaturization, multi-function, and high stability of electronic equipment are called the inevitable trend of development, and the varistor as a protective semiconductor element is also correspondingly moving toward thinner, lower voltage, and higher Reliability is developing, and zinc oxide varistors have been widely used...

Claims

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Application Information

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IPC IPC(8): C23C18/40
CPCC23C18/40C23C18/1639
Inventor 汪洋
Owner JIANGSU SHIRUI ELECTRONICS CO LTD
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