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Formula of chemical copper deposition liquid

A technology of chemical copper precipitation and formulation, applied in the field of formulation of copper precipitation liquid, can solve the problems of poor ductility, easy fracture or delamination, and coarse copper particles.

Inactive Publication Date: 2015-01-14
WUXI CHANGHUI ELECTROMECHANICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electroless copper plating process uses potassium sodium tartrate as a complexing agent for electroless copper plating, and the deposited copper particles are coarse and have poor ductility, and are easily broken or delaminated after high and low temperature cycle tests

Method used

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Examples

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Effect test

Embodiment 1

[0010] A formula of chemical copper precipitation solution, copper sulfate 9-12g / L, disodium edetate 30-32g / L, tetrahydroxypropyl ethylenediamine 15-16g / L, sodium hydroxide 12-15g / L L, potassium ferricyanide 0.09-0.1g / L, potassium ferrocyanide 0.01-0.03g / L, formaldehyde 12-15g / L. When the solution is prepared, the pH value is 12.5, and the temperature is controlled at 40-45°C.

[0011] When preparing this chemical copper precipitation solution, since the main salt copper sulfate is very easy to form copper hydroxide precipitation under the condition of no complex, so the complex is first dissolved with 60% deionized water or distilled water when preparing and the main salt copper sulfate, and then use another container to dissolve sodium hydroxide with 30% deionized water or distilled water, and then slowly inject the dissolved sodium hydroxide into the mixed solution of the complexing agent and copper sulfate with constant stirring, the color It will gradually turn dark blue...

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PUM

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Abstract

The invention discloses a formula of a chemical copper deposition liquid. The chemical copper deposition liquid consists of the following components: 9-12g / L copper sulfate, 30-32g / L disodium edetate dehydrate, 15-16g / L tetrahydroxypropyl ethylenediamine, 12-15g / L sodium hydroxide, 0.09-0.1g / L potassium ferricyanide, 0.01-0.03g / L potassium ferrocyanide and 12-15g / L formaldehyde. The invention provides the formula of the chemical copper deposition liquid with high stability and good elongation.

Description

technical field [0001] The invention relates to a formula of a copper sinking solution in a printed board copper plating process. Background technique [0002] At present, a process of electrically interconnecting the conductive patterns of each layer of the printed board is mainly realized by hole metallization technology. The most widely used process is electroless copper for hole metallization. For printed board processing, it is deposited on the activated printed board substrate and hole wall surface. The existing electroless copper plating process uses potassium sodium tartrate as a complexing agent for electroless copper plating. The deposited copper particles are coarse and have poor ductility, and are easily broken or delaminated after high and low temperature cycle tests. Contents of the invention [0003] Purpose of the invention: the present invention solves the above problems and provides a formulation of an electroless copper precipitation solution with high ...

Claims

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Application Information

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IPC IPC(8): C23C18/38
CPCC23C18/405
Inventor 杨彦涛
Owner WUXI CHANGHUI ELECTROMECHANICAL TECH
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