Copper electroplating solution for blind hole filling, and application thereof

Abstract

The invention provides a copper electroplating solution for blind hole filling. The copper electroplating solution is composed of the following components with the following concentration: 40-120 g / L of sulfuric acid, 120-240 g / L of copper sulfate pentahydrate, 40-80 ppm of chloride ions, 0.002-0.02 g / L of an accelerator, 0.1-0.3 g / L of an inhibitor, 0.01-0.1 g / L of a leveling agent and 0.002-0.02 g / L of a stabilizer, wherein the stabilizer is formed by compounding 2,2-dipyridyl and N,N,N' ,N' -tetrakis (2-hydroxypropyl) ethylenediamine according to a mass ratio of 1: (1 to 4). By adding the stabilizer composed of 2,2-dipyridyl and N,N,N' ,N' -tetrakis (2-hydroxypropyl) ethylenediamine into the copper electroplating solution, side reactions in the solution during soluble anode electroplating are controlled, the stability of the effects of the components such as the chlorine ions, the accelerator, the inhibitor and the leveling agent is ensured, and stable blind hole filling is realized.

Description

technical field [0001] The invention relates to the technical field of circuit board electroplating, in particular to a copper electroplating solution for filling blind holes with a soluble anode and an application thereof. Background technique [0002] In recent years, with the rapid development of electronic industry technology, electronic products are getting smaller and smaller, and their functions are more and more concentrated. Many electronic products must not only have powerful functions, but also have good portability. As the mother of electronic products, the circuit board must increase the circuit density as much as possible to save limited space. Thinning is an inevitable trend. [0003] The complete line of the circuit board is composed of plane wiring and interlayer hole interconnection. In order to meet the circuit board’s finer requirements, the plane wiring width and line spacing are already less than 75 microns, and some even reach 40 microns, while the in...

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Problems solved by technology

However, there will be side reactions on the anode that will affect the plating solution, thereby affecting the stability of the hole-filling additive. Especially in the case of discontinuous production, the repeated film-forming process of the anode will be more serious. It is used for hole-filling electroplating. It is difficult to achieve stable hole filling when using soluble anodes. How to use soluble anodes for stable hole filling is a subject that the industry has been exploring

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